#Japan #Tokyo #Semiconductor #CMC Research #Yosuke Hirumita

Upcoming Live Seminar on Semiconductor Manufacturing

Join us for an insightful live seminar titled "Fundamentals of Back-End Processes, Assembly, and Design in Semiconductor Manufacturing" hosted by CMC Research. This event is scheduled for July 3, 2026, from 1:30 PM to 4:30 PM via Zoom.

Seminar Overview

In the wake of the global semiconductor shortage caused by the COVID-19 pandemic, semiconductors have evolved from mere components to crucial elements of economic security. The seminar aims to delve into the imperative packaging technologies that significantly influence the performance of AI semiconductors.

Participants will gain a systematic understanding of:

• - Basic knowledge of semiconductor packaging
• - Overview of semiconductor manufacturing processes, focusing on the packaging aspect
• - Insights into packaging techniques and encapsulation technology
• - Evaluation and analysis techniques
• - Advances in chiplet technology and state-of-the-art packaging methodologies

Session Details

• - Date: July 3, 2026
• - Time: 1:30 PM to 4:30 PM (JST)
• - Format: Online via Zoom, with accompanying materials provided
• - Fee: 44,000 JPY (tax included), with special rates for newsletter subscribers and academics

- Newsletter subscribers: 39,600 JPY
- Academic participants: 26,400 JPY

Target Audience

This seminar is suitable for:

• - Engineers and researchers from chemical manufacturing and electronics sectors
• - Professionals seeking to learn the basics of semiconductor assembly technology
• - Those interested in the latest trends in advanced packaging techniques

Expert Instructor

The seminar will be led by Yosuke Hirumita, a consultant at his own technical office with a wealth of experience in quality and technology consulting. Yosuke has a robust background in the mechanical sector, specializing in processing, production systems, and industrial machinery. He has worked with renowned companies like Fujitsu and has contributed extensively to the field of semiconductor back-end processes.

Seminar Program Highlights

The seminar will cover various topics, organized thematically:
1. Basics of Semiconductor Packaging
- Evolution of various packaging forms from SIP to DIP, including advances in printed circuit board technologies.
2. Packaging Processes
- Detailed exploration of various packaging processes, including ceramics and plastic packaging.
3. Manufacturing Processes
- Key points and technologies involved in each stage of semiconductor production, including wire bonding and probing.
4. Past Challenges
- Discussion of issues encountered in previous development phases, such as chip cracks and wire disconnections.
5. Evaluation and Analysis Techniques
- Overview of common testing procedures and standards used to ensure the reliability of semiconductor products.
6. Sustainability Considerations
- Insights into the RoHS compliance and sustainability measures in semiconductor production.
7. Emerging Technologies
- Understanding the importance of 2.5D/3D packaging and chiplet technology in meeting future AI demands.
8. Future Trends
- Exploration of new packaging materials and techniques that support AI applications, including power delivery technologies.

This seminar also includes a Q&A session, giving participants the chance to engage directly with the instructor and clarify any doubts related to the discussed topics.

To register for the seminar, please visit CMC Research's official website for further details and secure your spot. Don’t miss this opportunity to expand your knowledge in the semiconductor field! Register Here