#Thermal Management #PCBAIR #Heavy-Copper

Solving AI's Thermal Challenges with Heavy-Copper PCBs

As the demand for more advanced artificial intelligence (AI) models grows, the dynamics of hardware engineering are also evolving. One of the most pressing challenges is the physical limitation of thermal management. High-performance AI computing requires servers and components that can withstand extreme power demands, often exceeding thermal design power ratings of 700W per chip. Traditional printed circuit board (PCB) designs have struggled to keep up with these requirements, leading to the emergence of heavy-copper PCBs.

What is Heavy-Copper PCB?

Heavy-copper PCBs utilize thicker copper layers than standard PCBs, effectively managing higher currents and reducing the associated I²R losses and thermal buildup. Recognizing the need for innovation in this space, PCBAIR, a prominent PCB manufacturer, has made significant upgrades to its heavy-copper manufacturing capabilities, enhancing the overall thermal management properties.

Key Upgrades.

PCBAIR’s upgraded production line now supports heavy copper fabrication up to 10 oz (approximately 350µm) for both the inner and outer PCB layers. This capacity turns the PCB into an effective heat spreader, crucial for data centers and HPC (High-Performance Computing) clusters. The technical enhancements include:

1. Embedded Copper Coin Technology: This innovative approach integrates solid copper