#Japan #Data Centers #Liquid Cooling #AI servers #Chiyoda

Upcoming Live Seminar on Liquid Cooling Technologies

On May 19, 2025, from 13:30 to 16:30, CMC Research will host a live seminar titled "Fundamentals and Applications of Liquid Cooling and Immersion Cooling Systems for AI Servers and Data Centers". This event aims to provide attendees with crucial insights into advanced cooling solutions necessary for modern AI technology and high-performance data centers.

Seminar Overview

The seminar will feature renowned expert Kazuhisa Yuki, a professor at Yamaguchi Tokyo University of Science, who brings years of experience in studying cooling technologies. As AI servers become increasingly powerful, with some GPUs consuming over 1,000 watts, traditional air cooling methods are becoming inadequate. In contrast, liquid cooling systems are gaining traction globally and are essential for efficient data center facilities.

Participants will gain vital knowledge in:

• - Fundamentals of heat transfer engineering essential for cooling system designs.
• - Simplified cooling design methodologies using heat transfer correlation equations.
• - Key concepts in immersion cooling, both single-phase and two-phase.
• - Addressing critical thermal challenges such as contact thermal resistance and heat spreaders.

Audience Target

The seminar is designed for professionals interested in cooling technologies used in data centers, including engineers, researchers, and decision-makers in the field.

Participation Fees

• - General Admission: 44,000 JPY (including tax, materials included)
• - CMC Newsletter Subscribers: 39,600 JPY (including tax)
• - Academic Price: 26,400 JPY (including tax)

How to Register

To register for this seminar, visit the CMC Research website. A URL for viewing will be sent via email after registration. Participants will have opportunities to ask questions during the session, encouraging interaction and deeper understanding.

Seminar Agenda

1. Introduction
2. Performance Differences: Air vs. Liquid vs. Immersion Cooling
3. Simplified Thermal Design Methods Using Heat Transfer Correlation
- 3.1 Three Modes of Heat Transfer
- 3.2 Simplified Thermal Design Methods for Air and Liquid Cooling Using Fans/Pumps
4. Immersion Cooling for Electronic Devices
- 4.1 Single-Phase Cooling (e.g., Oil Immersion Cooling)
- 4.2 Two-Phase Immersion Cooling
5. Addressing Thermal Challenges in Electronic Device Implementations
- 5.1 Contact Thermal Resistance
- 5.2 Heat Spreaders
6. Conclusion

Speaker Introduction

Kazuhisa Yuki has been engaged in cooling research since completing his Ph.D. in 1998 at Kyushu University. With over a decade at Tohoku University, he joined Yamaguchi Tokyo University of Science in 2009 and has focused on cooling technologies for high-density electronic components. He holds leadership roles in professional organizations related to heat transfer and electronic implementation reliability.

Related Upcoming Seminars

In addition to this seminar, CMC Research offers a slew of upcoming webinars on various critical topics, including microwave heating, validations in pharmaceuticals, and next-gen communication technologies. You can find the schedule and additional details on the CMC Research website.

We encourage everyone interested in this crucial field to participate and enhance their understanding of effective cooling solutions for AI and advanced technology environments. Don't miss this opportunity to stay ahead in the rapidly evolving world of data center cooling technology.