#United States #Scotts Valley #Digital Dynamics #Fusion.IO #Interlock Builder

Digital Dynamics Unveils Next-Gen Fusion Control Modules

Digital Dynamics Inc. (DDI), a prominent player in the technology sphere, has taken a significant step forward by launching its latest control solutions at SEMICON West held in Phoenix, Arizona. This groundbreaking collection of products promises to elevate operational safety, reduce costs, and simplify the complexity associated with semiconductor equipment manufacturing.

The Fusion.IO Platform

The cornerstone of DDI's exhibit is the Fusion.IO platform, a cutting-edge solution that facilitates the seamless integration of automated processes. Equipped with high-density mixed signal I/O capabilities and rapid, precise interlock control, this platform enables OEMs (Original Equipment Manufacturers) to attain system-level SIL3-rated functional safety. The focus on modularity and design flexibility further drives operational efficiency within a compact form factor, perfect for the ever-evolving semiconductor landscape.

Key Innovations Displayed

Several standout features highlighted during the event include:

1. Fusion.TMP: Enhancing the advanced PID process control functionality of Fusion.IO, this new feature brings critical temperature management tools such as PID autotuning, digital filtering, setpoint ramp control, and ratio control. Users can configure these capabilities through EtherCAT or utilize DDI's Interlock Builder software.

2. Fusion XL and RIM XL: Addressing the needs of OEMs requiring increased connectivity for high connector count, these extended chassis options ensure that all SIL-rated functional safety measures are met without compromising on performance.

3. Fusion XT: This variant provides ultimate flexibility in form factor while maintaining the high-performance features of the Fusion series, catering to OEMs looking for customizable solutions.

4. Safe Temperature Monitoring I/O Slot Card: This card supports various thermocouple types and RTDs, vital for systems requiring precise temperature measurements integrated with safety protocols.

5. Force-Guided Relay I/O Slot Card: Specifically designed for manufacturers needing dry contact outputs, this card is crucial in establishing SIL3-rated functional safety in multiple environments.

6. Interlock Builder v9.0: A massive upgrade to DDI’s interlock development software, this version improves capabilities such as interlock previsualization/simulation, enriched configurable options, and enhanced design functionalities, enabling a faster route to market for OEMs.

Voices from Digital Dynamics

The CEO of Digital Dynamics, Nir Merry, emphasized the pressing demand for OEMs in the semiconductor field. He stated, “These businesses face relentless pressure to enhance performance while ensuring utmost safety. Our innovations in integrated temperature control and modularity reflect our commitment to providing intelligent, scalable control solutions tailored to this industry.”

Likewise, Michael Summers, Application Engineering Manager, touted the Fusion.TMP controller and XL modular solution, calling them a breakthrough in not only boosting OEM productivity but also in enhancing overall system safety. “With certified hardware and user-friendly software, we're enabling customers to design safer, smarter, and larger systems at unprecedented speeds,” he added.

About Digital Dynamics Inc.

Established in Scotts Valley, California, Digital Dynamics Inc. has made its mark by delivering innovative, high-performance solutions tailored for the semiconductor and advanced manufacturing industries. With a strong focus on improving machine safety, efficiency, and performance—well-aligned with IEC61508 SIL compliance—DDI continues to lead the charge in technological advancements.

For further information about Digital Dynamics and their offerings, visit their website at www.digitaldynamics.com.