#Taiwan #Kaohsiung #ER Engineering #Laser Drilling #Hybrid Plasma

Introduction to ER Engineering's Innovations

At SEMICON Taiwan 2026, ER Engineering Corp. is set to reveal groundbreaking advancements in semiconductor processing technology. Specializing in laser and plasma systems, the company aims to meet the increased demand for precision in semiconductor manufacturing.

New Technologies Showcase

High-Precision Laser Drilling for Fiber Array Units

One of the standout offerings will be the high-precision laser drilling adapted specifically for Fiber Array Units (FAUs). With the ability to support 2D FAU configurations, ER Engineering's technology is capable of achieving bandwidths of up to 12.8 Tbit/s. The five-axis laser control ensures a drilling accuracy of just ±0.5 μm, allowing for intricate geometries and precise angular processing. This precision is crucial for integrating optical components in high-speed communications systems and Co-Packaged Optics (CPO).

Glass Core Processing and Through-Glass Vias

As the semiconductor industry increasingly turns to glass substrates, ER Engineering is pioneering laser solutions for glass core substrates and Through-Glass Vias (TGVs). These innovations address the industry's need for accuracy and adaptability in processing. The technology streamlines operations while reducing potential defects.

Supporting Glass Substrate Applications

ER Engineering also provides specialized services, including debonding and surface cleaning, crucial for maintaining the integrity of glass substrates. Their approach to eliminating contaminants, particularly polymer residues from temporary separations, highlights their commitment to quality.

Advanced Packaging and Precision Cutting

In addition to laser drilling, ER facilitates the precise cutting of large-format glass panels and provides Automated Bonding Film (ABF) routing solutions, which are essential for lane-defined packaging applications. By integrating laser and plasma technologies, the company aims to offer robust solutions for material processing and downstream surface treatment.

Core Technologies: PHB-600A and R-300 Systems

The PHB-600A model is designed explicitly for high-precision laser processing of large glass panels, perfectly aligning with advanced packaging requirements. On the other hand, the R-300 system employs a hybrid microwave-high frequency plasma technology. This innovative system enables flexible process adaptations tailored to various materials and application needs, assisting in process steps like cleaning and deep silicon etching, crucial for semiconductor manufacturing.

Integrated Solutions for the Future

ER Engineering's platform under the slogan "Laser Precision × Plasma Technology × Process Integration" positions the company as a leader in delivering integrated solutions for semiconductor production, advanced packaging, optical communication, and precision micro-manufacturing. Their commitment extends from initial research validation through to large-scale production development, ensuring their clients remain at the forefront of technological advancements.

Visit ER Engineering at SEMICON Taiwan 2026

Those attending SEMICON Taiwan can discover ER Engineering's innovations from September 2 to 4, 2026, at the Taipei Nangang Exhibition Center, stand M1048.

For more information, visit: ER Engineering.