#Japan #Tokyo #SEMICON Japan #Toray Research #Semiconductor Tech

Toray Research Center to Exhibit at SEMICON Japan 2025

Toray Research Center is thrilled to announce its participation in the upcoming SEMICON Japan 2025 event, scheduled to take place at Tokyo Big Sight from December 17 to December 19. This highly anticipated exhibition, organized by SEMI, will also include key contributions from Toray Industries, Toray Engineering Co., Ltd., Toray Engineering Advanced Semiconductor MI Technology Co., Ltd., and Toray Precision Co., Ltd.

The Toray booth will spotlight state-of-the-art analytical technologies related to advanced semiconductor devices and electronic materials. Attendees are encouraged to stop by and explore the innovative exhibits that will be on display.

Event Details

• - Date: December 17 (Wed) - 19 (Fri), 2025
• - Location: Tokyo Big Sight
• - Booth Number: East Exhibition Hall, E4908 (APCS Area)

Exhibition Highlights

Toray will present an array of cutting-edge technologies and analytical capabilities, with several key focuses:

1. Innovative Equipment and Unique Analytical Technologies

• - ICON-IR Adhesive Interface Analysis - Scheduled for installation in April 2025.
• - ESR Technique for depth profiling of defect quantities in SiN films.
• - Micro RBS for high-accuracy compositional assessment of thin films in 3D structures.
• - HAXPES for elemental composition and chemical state analysis of GaN.
• - STEM, CL, DLTS methodologies for defect analysis of GaN-HEMT devices.

2. Material Evaluation and Analysis

• - Gas permeability evaluation of device materials using isotopic gases.
• - Optimal equipment selection for Raman analysis of semiconductor materials.
• - Quality assessment of Low-k materials; SiOC thin films.

3. Process Evaluation and Optimization

• - Initial structural analysis of ALD-SiN films using FT-IR techniques.
• - Point defects and dislocation evaluation of silicon power devices via cathodoluminescence (CL).
• - Roughness and contamination evaluation of trench structure sidewalls.
• - Optimization of hybrid bonding processes through interface analysis of wafer bonding samples.
• - Thermal curing behavior analysis of resin used for semiconductor encapsulation.

4. Device Evaluation and Development Support

• - Case studies on thermal property evaluation of packaging materials.
• - Luminescence analysis supporting advanced communication device development.
• - Potential contrast observation of semiconductor devices via multi-ion species plasma FIB.
• - Emission characteristics evaluation of VCSEL using helium-cooled STEM-CL methods.

5. Mapping and Visualization

• - N image evaluation in solution-grown SiC crystals using SIMS.
• - 3D imaging of trace elements in SiC substrates via fsLA-ICP-MS.
• - Stress measurement of thin films - applicable for dimensions from 50 to 300 mm in diameters, temperature-dependent response.
• - Thermal strain distribution analysis of cooling and heating processes using μ-DIC - applicable for PCB and SiC-MOSFET.
• - Micro-composition analysis of polymer materials inside packaged components through O-PTIR method.

6. Analytical Techniques and Sample Preparation

• - Structural analysis of polymer-bound photoacid generators in chemical amplification resists for EUV lithography.
• - Outgassing analysis of heat-resistant resins during high-temperature heating.
• - Metal particle analysis in resists using spICP-MS.
• - Ionic impurity analysis on silicon wafer surfaces.

7. Analysis and Simulation

• - The impact of fillers on the thermal curing process of resins - combining thermal analysis and molecular dynamics simulation.

8. Global Market Support Services

• - Toray Research Center’s advanced analytical services for semiconductors and electronic materials tailored for global markets.
• - Localized advanced chemical analysis services for semiconductors and electronic materials in Europe and China.

9. Partner Company Functions

• - Discovery of sulfur compounds from everyday packaging materials! [Toray Tech Co., Ltd.]
• - Management of ultra-pure water - water quality monitoring and anomaly response. [Toray Tech Co., Ltd.]
• - Physical property measurement via electronic device extraction. [NTT Device Cross Technology Co., Ltd.]
• - Total solutions for power devices - from prototypes to power cycling, analysis, and simulation.

We look forward to meeting you at SEMICON Japan 2025 and sharing our latest advancements in semiconductor technology!