LITEON Showcases AI Innovations and NVIDIA MGX Platform at electronica 2026

LITEON's Technological Showcase at electronica 2026

The technology landscape is rapidly evolving, and at the forefront of this change is LITEON Technology (2301), which took center stage at electronica 2026, held from November 10 to 13 in Munich, Germany. Under the theme of "LITEON Powers AI," the company presented a suite of innovations designed to facilitate powerful AI applications from cloud to edge.

As AI computation continues to expand and power density intensifies, LITEON revealed its extensive portfolio of AI power solutions that accommodate NVIDIA MGX architectures as well as OCP Open Rack V3 (ORV3). LITEON's offerings span from rack-level power distribution to backup energy solutions and chip-level power conversion.

Innovations in Power Distribution

Among the highlights was LITEON’s Power Shelf boasting a capacity of 110 kW that is tailored to support NVIDIA's Vera Rubin NVL72 architecture. This innovative shelf features active current sharing and input current smoothing to enhance power stability amid dynamic AI workloads. Additionally, they showcased a compact 72 kW power shelf designed to optimize space without compromising on output power.

The company's presence at electronica was further augmented by a virtual interactive rack demonstration, displaying configurations of 330 kW, 880 kW, and 1.2 MW, showcasing the evolution towards high-density rack infrastructure essential for megawatt-scale AI operations.

LITEON also unveiled its High-Power Capacitor Backup Unit (CBU), which is aimed at strengthening electrical resilience. Coupled with chip-level power solutions such as Intermediate Bus Converters (IBC), Voltage Regulation Modules (VRM), and high-efficiency power supplies, these technologies serve to minimize conversion losses and support high-density AI computation.

Extending AI from Cloud to Edge

As the demand for edge computing rises, LITEON is bridging the gap by introducing a range of power, networking, 5G, and AI vision solutions aimed at enterprise and industrial applications at the edge. The diverse array of power solutions includes Common Redundant Power Supplies (CRPS) of 800 W and 2,000 W, high-power PoE injectors, as well as DIN rail power supplies ranging from 12 W to 960 W. The company also offers industrial-grade AC/DC and DC/DC converters, as well as medical-grade power solutions aimed at various edge applications.

In the connectivity domain, LITEON's Connected AI Edge ecosystem comprises O-RAN radio units supporting both FR1 and FR2 bands. They further enhanced this offering with an AI-RAN solution built on NVIDIA’s AI Aerial platform, essentially integrating AI computing into 5G connectivity. Following their integration with U-MEDIA, LITEON launched a Fixed Wireless Access (FWA) solution, along with an array of all-in-one small cells, Ethernet switches, and Wi-Fi access points.

To cater to intelligent edge applications, they also showcased AI-driven security cameras and AI enclosures capable of local inference for immediate analysis and decision-making in sectors like smart buildings, healthcare, retail, and industrial automation. These innovations together amplify LITEON’s capabilities across power, connectivity, and intelligent computing, fortifying infrastructure from high-density data centers to advanced smart edge applications.

In conclusion, LITEON's presentation at electronica 2026 exemplifies a commitment to advancing AI technology and addressing the growing power and connectivity needs of both cloud and edge computing, paving the way for smarter, more connected environments in the future.