Technication Expands Commitment Line with Resona Bank
On November 28, 2025, Technication Co., Ltd., headquartered in Shinjuku, Tokyo, signed a new commitment line agreement with Resona Bank, raising the limit by 300 million yen. Previously, the company had established a commitment line of 200 million yen, which brings the total commitment line to 500 million yen.
Commitment Line Details
- - Lender: Resona Bank
- - Loan Amount: 300 million yen
- - Date of Agreement: November 28, 2025
- - Type of Loan: Commitment Line (Over-the-Counter Transaction)
- - Purpose: Working capital and business enhancement
Background and Purpose
The previous year's utilization of the 200 million yen commitment line allowed Technication to significantly accelerate its business growth. The company reported a revenue of approximately 3.3 billion yen, and its performance has been on a steady upward trajectory.
To further enhance its value to client companies and reach more engineers with its mission, Technication recognizes the necessity of establishing a flexible and stable funding framework corresponding to its business expansion. Given this background, the company has signed a new commitment line agreement with Resona Bank to reinforce its financial foundation and ensure the agile provision of working capital.
Through this agreement, Technication aims to promote further challenges and value creation toward achieving its vision of "New Meritocracy for Everyone." The company is committed to responding flexibly to changes in the business environment while striving for sustainable growth and contribution to society.
Company Overview
- - Company Name: Technication Co., Ltd.
- - Headquarters: Shinjuku Mitsui Building, 36F, 2-1-1 Nishi-Shinjuku, Shinjuku-Ku, Tokyo 163-0436
- - CEO: Ken Nishida
- - Founded: November 2019
- - Number of Employees: 433
- - Capital: 100 million yen
- - Business Summary: SES (System Engineering Service) and recruitment support business
- - Website: Technication
For inquiries regarding this matter, please use the contact form.