Compal Unveils NVIDIA AI Factory Infrastructure at OCP Global Summit 2026

Compal Showcases Next-Gen AI Factory Infrastructure at OCP Global Summit 2026

In a groundbreaking announcement, Compal Electronics, Inc. has revealed its plans to showcase next-generation AI factory infrastructure at the OCP Global Summit 2026 in San Jose, California. The focus is on addressing the increasing demands of NVIDIA's accelerated computing technology through advancements in power supply, cooling, computing power, and rack-scale engineering.

As AI data centers reach unprecedented levels of computing density and energy requirements in the megawatt range, simply adding more GPUs is no longer sufficient. The critical infrastructure surrounding accelerated computing — from power supply to thermal management and rack integration — must be meticulously redesigned. This redesign aims to ensure the necessary performance, efficiency, and scalability for next-gen AI workloads.

At the OCP event, Compal will demonstrate how it is evolving this infrastructure tailored to NVIDIA's accelerated computing needs. The company is set to combine high-density computing platforms with next-generation power supply and cooling technologies, establishing a more integrated foundation for scalable AI factories.

Redesigning Power Supply for AI Factories

The architecture of the power supply is quickly becoming one of the most significant challenges facing large-scale AI infrastructures. To address the rapidly increasing power density in racks, Compal is advancing the development of an 800-VDC power supply architecture designed explicitly for next-gen AI data centers. By transitioning to higher-voltage direct current architectures along with more efficient supply systems, Compal aims to reduce the complexity of power conversion and support increasingly dense AI environments. This innovative approach creates a scalable power supply foundation that will evolve alongside future advancements in accelerated computing capabilities.

Cooling Infrastructure for Higher Density

Higher computing density necessitates a fundamental shift in heat management practices. Compal is expanding its infrastructure portfolio by incorporating advanced liquid cooling technologies and megawatt-level cooling capacities, ensuring that AI systems can operate efficiently even as rack densities continue to rise. Rather than treating computing power, power supply, and cooling as separate systems, Compal views them as interlinked components of the AI factory. By considering these technologies together at the rack and data center level, Compal can optimally tailor the infrastructure to meet the demands of high-performance accelerated computing.

Evolving from the Power Supply to GPUs

Together, these capabilities signify Compal's evolution beyond individual server platforms to a comprehensive strategy for AI infrastructure. By integrating accelerated computing, power supply, cooling, and rack-level integration with global development and manufacturing resources, Compal is helping its clients bridge the gap between cutting-edge AI technologies and their large-scale practical applications.

As Alan Chang, Vice President of ISBG at Compal stated, "Building the next generation of AI factories requires us to rethink the entire infrastructure surrounding accelerated computing. Compal combines power supply, cooling, rack integration, and NVIDIA’s accelerated computing to assist clients in constructing AI infrastructure that can efficiently scale from platform level to megawatt-scale implementations."

At the OCP, Compal will illustrate how these infrastructure technologies work in concert to tackle the growing challenges concerning power supply, heat dissipation, and deployment in the AI era — thereby creating the critical infrastructure from the power grid to the GPU.

Visit Compal at the OCP Global Summit 2026 at booth E65 to discover the innovative infrastructure behind the next generation of NVIDIA-powered AI factories.

About Compal Electronics

Founded in 1984, Compal has evolved into a leading global manufacturer of computers and smart devices, partnering with top-tier brands worldwide. Recognized as one of Taiwan’s seven leading manufacturers by CommonWealth Magazine, Compal has consistently ranked among the Forbes Global 2000 companies. The company has actively expanded into new growth areas, including cloud servers, automotive electronics, intelligent medical solutions, and advanced communication solutions. Headquartered in Taipei, Taiwan, Compal operates development and manufacturing facilities across the United States, Taiwan, China, Vietnam, Mexico, Brazil, and Poland. Visit Compal's website for more information.