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Upcoming Live Seminar: 5G/6G Flexible Substrates

CMC Research is excited to announce a live seminar titled "Flexible Substrates and FPC Technologies for 5G/6G - LCP-FCCL and Its Developments". This event will take place on October 15, 2025, from 1:30 PM to 4:30 PM via Zoom, complete with an on-demand recording for those who can't attend the live session.

Seminar Overview

In recent years, the demand for flexible printed circuits (FPCs) utilizing low-dielectric substrates has escalated, particularly in the smartphone sector. As technology evolves, current materials like LCP (Liquid Crystal Polymer) and MPI (Modified Polyimide) may soon struggle to meet dielectric performance requirements. This seminar aims to address these challenges by exploring alternatives that have been developed to maintain both low dielectric properties and the core characteristics necessary for effective FPC design.

Who Should Attend?

This seminar is highly recommended for:

• - Development engineers focused on high-frequency applications
• - Individuals interested in advanced flexible substrates and FPC formation processes.
• - Anyone involved in the design, development, and application of FPC materials.

Seminar Details

• - Speaker: Hiroyuki Ohata of FM Tech
• - Date and Time: Wednesday, October 15, 2025, from 1:30 PM to 4:30 PM
• - Format: Live streaming via Zoom with on-demand access available post-event (materials included)
• - Fees:

- General registration: ¥44,000 (including tax)
- Newsletter subscribers: ¥39,600 (including tax)
- Academic attendees: ¥26,400 (including tax)

Key Learning Points

Participants will gain insights into the following:
1. Essential characteristics required in FPC substrates
2. Reasons behind the use of LCP and polyimide films in FPC development
3. Techniques for multilayer LCP construction
4. Considerations during LCP film processing
5. Hybridization methods with low-dielectric materials

What to Expect from the Seminar

The seminar will consist of eight sections, allowing for an in-depth discussion on topics from the basic properties of FPCs to detailed studies on the hybridization of LCP with low dielectric materials. Special focus will be placed on:

• - Introduction to FPCs: An overview of structures and the required characteristics.
• - LCP Material Insights: The history and future of LCP-based FPCs, touching on the challenges currently faced in the market.
• - Assembly Techniques: Methods for embedding electrodes, forming vias, and ensuring layer bonding.

Q&A Session

Participants will have an opportunity to engage with the speaker during a dedicated Q&A segment, making this a valuable experience for professionals eager to enhance their knowledge and applications in the field.

Registration

To register for the seminar, please visit CMC Research's official site here. Once registered, a link for accessing the seminar will be provided via email. Further details and updates on the seminar can also be obtained from the same site.

Conclusion

This seminar represents a unique opportunity to gain crucial insights into the future of flexible substrates for upcoming technologies like 5G/6G. Whether you are looking to deepen your understanding or expand your professional capabilities, this event is poised to be an invaluable learning experience. Don't miss out on this chance to stay at the forefront of technology in the flexible printed circuit domain!

Join us on October 15, 2025, to explore the future of FPC technology for 5G/6G applications!