Panduit to Present Advanced AI and Data Center Solutions at SC26 Conference
As the fields of High-Performance Computing (HPC) and Artificial Intelligence (AI) continue to expand, the infrastructure supporting these technologies becomes increasingly vital. Panduit, recognized as a frontrunner in electrical and network infrastructure solutions, is set to showcase its cutting-edge offerings at the SC26 conference. Taking place from November 15 to November 20, 2026, at McCormick Place in Chicago, this year's event highlights the growing importance of efficient power management, cooling systems, and high-density connectivity in modern computing environments.
The demand for computing power in HPC and AI applications has surged, with organizations striving to maximize capacity while managing their energy consumption and heat generation. In response, Panduit will demonstrate a comprehensive portfolio of integrated solutions aimed at addressing these interconnected challenges. At booth #4000, the company will exhibit technologies that encompass power distribution, cooling systems, and connectivity, showcasing their role in fostering resilient IT infrastructures.
Tom Kelly, Chief Technology Officer of Panduit, emphasizes the growing demands HPC and AI workloads place on existing physical infrastructures. "AI and HPC are raising the expectations for the infrastructure that supports computing environments," he stated. "At SC26, we will demonstrate how power, cooling, connectivity, and infrastructure management work together to help organizations meet current requirements and adapt to evolving computational demands."
Direct-to-Chip (DTC) Cooling Solutions
Panduit's collaboration with SEGUENTE will feature the innovative FlexFusion™ DTC Cooling Cabinet, which integrates cooling technology directly into the computing gear, thereby improving efficiency in managing heat generated by high-density deployments. The showcase will highlight the use of the SEGUENTE COLDWARE® platform, known for its liquid-cooling capabilities combined with intelligent software that provides ongoing operational visibility and management.
High-Density Fiber Connectivity
High-density fiber infrastructures are crucial for meeting the data requirements of AI and HPC applications. Panduit will display several connectivity solutions designed to minimize space while maximizing capacity, including the HD Fusion Fiber Wall Mount Splice Enclosure, which can accommodate between 864 to 3,456 fibers. Other innovative tools like the High Density Consolidation Point (HDCP) for in-cabinet management and the tool-less PanMPO connectivity options will also be featured, allowing for flexible interface management in the field.
Power Distribution and Monitoring Technologies
Ensuring reliable power supply remains a fundamental requirement for any computing infrastructure. Panduit will introduce its EL2P™ and ES2P power distribution units (PDUs), alongside environmental sensors that monitor conditions within racks. These technologies promise to enhance operational control and ensure uptime for critical equipment.
Cable Management Solutions
A well-managed cabling system is integral to the performance of high-density environments. Panduit's FiberRunner™ cable routing system will be showcased to help organize and protect fiber cabling, facilitating efficient management and minimizing interferences as connectivity demands rise.
In an effort to address the urgent requirements of data centers, Panduit will also promote its Quick Ship Fiber Program, featuring pre-qualified fiber configurations with a rapid delivery promise within 10 business days. This initiative aims to support clients' needs by reducing downtime and expediting project timelines.
Attendees are encouraged to visit booth #4000 during the conference, with demonstrations scheduled for November 17 and 18 from 10 AM to 6 PM CST, and on November 19 from 10 AM to 3 PM CST. With an emphasis on holistic solutions that combine innovation and functionality, Panduit aims to empower organizations to meet today's computing challenges effectively.
For additional details on Panduit's infrastructure solutions tailored to AI data centers, interested parties can explore Panduit's website.
With a legacy dating back to 1955, Panduit operates as a leading global manufacturer of high-quality electrical and network infrastructure solutions. Headquartered in Tinley Park, Illinois, the company emphasizes continuous innovation, strategic R&D investments, and global service excellence as pillars guiding its operations. Panduit prides itself on creating exceptional solutions tailored to meet the evolving needs of its customers while being committed to sustainability and positive societal impact.
Panduit's Approach to HPC and AI
The demand for computing power in HPC and AI applications has surged, with organizations striving to maximize capacity while managing their energy consumption and heat generation. In response, Panduit will demonstrate a comprehensive portfolio of integrated solutions aimed at addressing these interconnected challenges. At booth #4000, the company will exhibit technologies that encompass power distribution, cooling systems, and connectivity, showcasing their role in fostering resilient IT infrastructures.
Tom Kelly, Chief Technology Officer of Panduit, emphasizes the growing demands HPC and AI workloads place on existing physical infrastructures. "AI and HPC are raising the expectations for the infrastructure that supports computing environments," he stated. "At SC26, we will demonstrate how power, cooling, connectivity, and infrastructure management work together to help organizations meet current requirements and adapt to evolving computational demands."
Key Technologies Showcased
Direct-to-Chip (DTC) Cooling Solutions
Panduit's collaboration with SEGUENTE will feature the innovative FlexFusion™ DTC Cooling Cabinet, which integrates cooling technology directly into the computing gear, thereby improving efficiency in managing heat generated by high-density deployments. The showcase will highlight the use of the SEGUENTE COLDWARE® platform, known for its liquid-cooling capabilities combined with intelligent software that provides ongoing operational visibility and management.
High-Density Fiber Connectivity
High-density fiber infrastructures are crucial for meeting the data requirements of AI and HPC applications. Panduit will display several connectivity solutions designed to minimize space while maximizing capacity, including the HD Fusion Fiber Wall Mount Splice Enclosure, which can accommodate between 864 to 3,456 fibers. Other innovative tools like the High Density Consolidation Point (HDCP) for in-cabinet management and the tool-less PanMPO connectivity options will also be featured, allowing for flexible interface management in the field.
Power Distribution and Monitoring Technologies
Ensuring reliable power supply remains a fundamental requirement for any computing infrastructure. Panduit will introduce its EL2P™ and ES2P power distribution units (PDUs), alongside environmental sensors that monitor conditions within racks. These technologies promise to enhance operational control and ensure uptime for critical equipment.
Cable Management Solutions
A well-managed cabling system is integral to the performance of high-density environments. Panduit's FiberRunner™ cable routing system will be showcased to help organize and protect fiber cabling, facilitating efficient management and minimizing interferences as connectivity demands rise.
Quick Ship Fiber Program
In an effort to address the urgent requirements of data centers, Panduit will also promote its Quick Ship Fiber Program, featuring pre-qualified fiber configurations with a rapid delivery promise within 10 business days. This initiative aims to support clients' needs by reducing downtime and expediting project timelines.
Visit Panduit at SC26
Attendees are encouraged to visit booth #4000 during the conference, with demonstrations scheduled for November 17 and 18 from 10 AM to 6 PM CST, and on November 19 from 10 AM to 3 PM CST. With an emphasis on holistic solutions that combine innovation and functionality, Panduit aims to empower organizations to meet today's computing challenges effectively.
For additional details on Panduit's infrastructure solutions tailored to AI data centers, interested parties can explore Panduit's website.
About Panduit
With a legacy dating back to 1955, Panduit operates as a leading global manufacturer of high-quality electrical and network infrastructure solutions. Headquartered in Tinley Park, Illinois, the company emphasizes continuous innovation, strategic R&D investments, and global service excellence as pillars guiding its operations. Panduit prides itself on creating exceptional solutions tailored to meet the evolving needs of its customers while being committed to sustainability and positive societal impact.
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