DuPont Unveils Next-Gen Circuit Solutions at Intelligent Asia Thailand 2025

DuPont Showcases Innovative Circuit Solutions at Intelligent Asia Thailand 2025

DuPont, a frontrunner in advanced technology and materials, is set to present its latest developments in circuit materials at the upcoming Intelligent Asia Thailand 2025. The event, hosted at the Bangkok International Trade Exhibition Centre (BITEC) from March 6 to 8, 2025, will highlight DuPont's commitment to enhancing the future of electronics through revolutionary solutions.

As industries increasingly rely on advanced electronic devices, the demand for innovative materials in printed circuit boards (PCBs) is soaring. Yuan Yuan Zhou, the Global Business Director for Advanced Circuit Packaging at DuPont, notes that artificial intelligence (AI) is reshaping the landscape of the electronics industry, pushing the boundaries of innovation at a rapid pace.

"With our extensive product portfolio and expertise, we are well-equipped to meet the growing needs for high-performance electronics, particularly as device miniaturization and computational speed become essential in today’s market," Zhou emphasizes. This strategic positioning enables DuPont to support PCB manufacturers in the rapidly growing Southeast Asian market, facilitating their expansion and innovation.

Innovations on Display

The spectral showcase at Intelligent Asia will detail several of DuPont's state-of-the-art products designed for various applications, including:

1. DuPont™ Copper Gleam™ PPR-II/III: This next-generation electroplating solution is tailored for advanced multilayer boards (MLBs) and AI server station applications. It features superior throwing power for through-hole plating, ensuring optimal thickness distribution crucial for high-reliability requirements.

2. DuPont™ Circuposit™ 6800W: This electroless copper solution is specifically engineered for multi-stack micro-via designs. When paired with Copper Gleam™ PS-100, it provides an efficient alternative to conventional processes, improving reliability for automotive and AI applications.

3. DuPont™ Riston® DI9500M: As a multi-wavelength direct imaging solution, this photoresist caters to pitch requirements of 70μm or greater, making it ideal for both rigid and flex PCs. Its fine-line resolution enhances yield in electrified automotive and AI server contexts.

4. DuPont™ Microfill™ EVF-III: This new via-filling technology excels in HDI applications aimed at automotive uses. It significantly enhances performance through improved through-hole capabilities.

5. DuPont™ Pyralux® AP: This flexible copper-clad laminate provides outstanding reliability and diminishes transmission loss, meeting the high demands of speed and frequency in modern electronics.

DuPont’s products are developed to address crucial factors such as efficiency, reliability, and performance in increasingly complex electronic environments.

Engaging Industry Experts

Visitors to the DuPont booth can expect to engage with industry experts who will share insights on emerging technologies, trends, and DuPont's comprehensive range of solutions catered to evolving electronics demands. The company is positioning itself as a leader amid the rapid advancements in the PCB industry, underscoring its role in boosting the capabilities of interconnected technologies.

About DuPont

DuPont (NYSE: DD) stands at the forefront of innovation, providing technological materials and solutions that change industries and enhance daily life. With a presence across various markets including electronics and healthcare, DuPont continues to empower its customers towards advancing their ideas and realizing essential innovations. For more details, visit www.dupont.com.

By participating in events like Intelligent Asia Thailand 2025, DuPont reinforces its commitment to driving innovation in the electronics sector, shaping the future of intelligent technologies.