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Ansys and TSMC Unite for Advanced Semiconductor Engineering

In a significant move for semiconductor innovation, Ansys and TSMC have announced a strengthened partnership aimed at enhancing the design processes for advanced nodes and 3D integrated circuits (3D-ICs). The collaboration focuses on integrating AI-assisted workflows to support various design optimizations crucial for high-performance computing (HPC) and artificial intelligence (AI) applications.

Advancements in Design Workflows

The enhanced workflows introduced by Ansys and TSMC encompass advanced radio frequency (RF) designs and photonic integrated circuits (PICs). These innovations are set to streamline the migration during technology node transitions, promoting a seamless design process. The duo aims to optimize the design and reliability of semiconductor solutions by leveraging TSMC's latest advancements, such as the Compact Universal Photonic Engine (COUPE) platform and cutting-edge AI technologies.

Certifications for Cutting-Edge Processes

Recently, Ansys announced that its RedHawk-SC™, Totem™, and RedHawk-SC Electrothermal™ platforms have achieved certification for TSMC's latest A16™ process. This certification highlights their capability for electromigration (EM) and voltage drop (IR) analysis, critical for the modern demands of analog and system-on-chip (SoC) designs. Additionally, their HFSS-IC Pro solution has received certification to support the advanced processes of TSMC’s 5nm and 3nm technologies, ensuring utmost accuracy in electromagnetic analysis for next-generation semiconductor products.

Innovative Thermal Management Solutions

With the A16 process, Ansys and TSMC have pioneered a refined thermal analysis methodology aimed at reliable thermal management. This methodology utilizes precise thermal specifications from TSMC to deliver accurate temperature assessments, thereby enhancing performance in advanced applications. Continued collaboration includes preparations for the A14 technology, ensuring that upcoming solutions meet the industry's growing energy efficiency requirements.

AI-Driven Optimization for RF Design

The joint efforts between TSMC, Ansys, and Synopsys have led to the development of an AI-assisted RF design migration workflow. This innovative flow integrates Ansys’ HFSS-IC Pro AI technology with tools from Synopsys, enabling the optimization of component placement and routing while maintaining design integrity. This is particularly crucial as the industry transitions to more complex nodes, where traditional RF IC migration poses significant challenges to performance and efficiency.

Multiphysics Analysis Integration

Ansys’ RedHawk-SC, along with Synopsys’ 3DIC Compiler™, are now part of a comprehensive multiphysics analysis platform designed to enable extensive extraction, timing, power analysis, EM/IR, and thermal evaluations. This platform enhances the precision of thermal-aware timing assessments and is instrumental in aiding clients to expedite the convergence of large-scale 3D-IC designs.

Future Outlook

According to John Lee, vice president at Ansys, the collaboration not only fosters innovation in 3D-IC design but also reinforces chip reliability for demanding applications. The ongoing optimization efforts in electromagnetics, thermal management, and structural integrity provide confidence to customers regarding meeting stringent product specifications.

Furthermore, Lipen Yuan from TSMC emphasized that AI-driven solutions markedly enhance productivity in designing complex 3D-IC components. The partnership with Ansys and Synopsys ensures that customers can fully leverage the advantages of cutting-edge technologies, propelling innovation across various sectors including automotive, HPC, mobile, and AI solutions.

In summary, the collaboration between Ansys and TSMC signifies a pivotal advancement in the semiconductor industry, paving the way for future technological breakthroughs and enhanced product offerings that cater to the ever-evolving demands of the market.