#United States #Westminster #STMicroelectronics #Trimble #Teseo VI

Trimble Collaborates with STMicroelectronics for Enhanced Positioning Solutions

Trimble, a well-known player in positioning technologies, has entered into a significant partnership with STMicroelectronics to deliver advanced positioning solutions aimed at revolutionizing automotive and IoT landscapes. This collaboration aims to streamline the development and implementation of precise positioning technologies, crucial for modern vehicles and smart devices.

This groundbreaking initiative sees the integration of Trimble's Trimble ProPoint™ Go positioning engine with STMicroelectronics' innovative Teseo VI GNSS chipsets. With the unique features of ProPoint Go combined with the advanced capabilities of the Teseo VI chipsets, manufacturers (OEMs) are set to benefit from a solution that prioritizes high-performance, cost-effectiveness, and reduced time-to-market.

Features and Benefits of the Collaboration

The combined positioning solution will cater specifically to applications like automotive navigation, advanced driver-assistance systems (ADAS), cellular vehicle-to-everything (C-V2X) communication, field robotics, and unmanned aerial vehicles (UAVs). Here are some key highlights of what this partnership brings to the table:

• - Enhanced Accuracy: The Teseo VI supports quad-band GNSS (L1, L2, L5, E6), greatly improving signal availability and accuracy, especially in complex environments such as urban canyons.
• - Precision Data: The Trimble ProPoint Go offers high-accuracy position and orientation data, supported by globally accessible Trimble correction services, producing centimeter-level precision.
• - Safety Certified: With Automotive Safety Integrity Level-C (ASIL-C) certified correction data, the partnership prioritizes enhanced safety for automated driving capabilities and IoT applications.
• - Scalability: Built to meet mass-market demands, the joint solution offers a scalable approach suitable for various industries.

Olivier Casabianca, vice president of advanced positioning at Trimble, emphasized the importance of this collaboration: “We are dedicated to delivering the most accurate positioning and orientation data, especially for challenging environments. Our partnership with STMicroelectronics guarantees a robust and economical solution, beneficial across a spectrum of automotive and industrial applications.”

Looking Ahead

This collaboration not only solidifies Trimble's commitment to innovation in positioning solutions but also showcases STMicroelectronics’ capability in the automotive GNSS market. The companies have been collaborating for several years, and this expanded partnership signifies a commitment to transforming precision positioning applications.

According to Luca Celant, general manager of digital, audio, and signal solutions division at STMicroelectronics, this collaboration holds tremendous promise, offering industries a faster pathway for implementing precise positioning capabilities.

Upcoming Events

For those interested in exploring the capabilities of this joint solution, STMicroelectronics will showcase its Teseo VI GNSS receivers at the upcoming Mobile World Congress from March 3-6, 2025, at Hall 7, Booth 7A61 in Barcelona, Spain. Additionally, the combined solution will also be on display at the Embedded World Conference from March 11-13, 2025, at STMicroelectronics Booth 4A-148 in Nuremberg, Germany.

As industries increasingly adopt automation and IoT technologies, the collaboration between Trimble and STMicroelectronics is poised to play a critical role in enhancing vehicular navigation and overall positioning accuracy. The precise positioning solutions provided by this partnership will likely empower manufacturers, leading to safer and more efficient automotive technologies.

For further details about Trimble's positioning technology, visit Trimble's official site and for insights into STMicroelectronics’ offerings, check their Teseo product page.