Mitsubishi Chemical Group Collaborates with Boston Materials for Semiconductor Packaging Innovation
In an exciting development for the semiconductor industry, Mitsubishi Chemical Group (MCG) and Boston Materials, Inc. have entered into a strategic collaboration aimed at improving thermal management solutions necessary for advanced high-performance computing (HPC) and artificial intelligence (AI) data center applications. Announced on December 11, 2025, this partnership comes alongside an investment from MCG’s venture arm, Diamond Edge Ventures, which underscores the commitment of both companies to foster innovation and enhance their product offerings. The primary focus of this collaboration is the development of the next generation of Boston Materials’ flagship product, the Liquid Metal ZRT®. This thermal interface material (TIM) incorporates patented Z-axis Carbon Fiber™ technology and unique liquid metal alloys, which are essential for tackling the pressing thermal management challenges faced in semiconductors today. Thermal management remains a crucial issue that limits the performance scaling of HPC and AI systems. According to Curtis Schickner, President of Diamond Edge Ventures, the Liquid Metal ZRT product stands out as an effective solution to these challenges, presenting significant performance advantages over existing thermal management solutions currently on the market. He further asserted that, after rigorous vetting of the product’s capabilities, Mitsubishi Chemical Group has recognized Boston Materials as a key strategic partner to enhance their comprehensive high-performance material solutions for the semiconductor sector.
The first-generation Liquid Metal ZRT® product, known as LMZ1100, has already made waves in the industry with its proven ability to provide over 10°C cooling enhancement for kilowatt-scale, liquid-cooled ASICs and GPUs. This impressive performance not only optimizes thermal management but also ensures long-term reliability, making it suitable for high uptime applications. The product is also designed with high-volume manufacturing (HVM) integration in mind, which is critical for scaling production as demand continues to grow in the semiconductor landscape. The second-generation Liquid Metal ZRT product resulting from this collaboration promises even greater thermal efficacy and reliability, thereby addressing the growing needs of AI infrastructure. Anvesh Gurijala, CEO of Boston Materials, emphasized the significance of this partnership in expanding the reach of their innovative product while accelerating their development roadmap.
In line with this initiative, MCG plans to set up specialized labs for advanced semiconductor packaging integration and application development across Asia. This infrastructure will play a pivotal role in facilitating the commercialization and mass deployment of the Liquid Metal ZRT product across the Asia-Pacific (APAC) region, which is a hotbed for semiconductor innovation. This collaboration reflects Mitsubishi Chemical Group's strategic direction towards establishing itself as a premier player in high-performance, functional materials for the semiconductor industry. The prospect of enhanced thermal management capabilities through advanced materials will undoubtedly catalyze improvements in AI and HPC technologies, ultimately driving the next wave of innovation in the sector. This partnership stands as a testament to the importance of material innovation in overcoming the challenges faced by the semiconductor sector today, thereby ensuring continued growth and expansion in this critical industry. As both companies look forward to the future, it’s clear that the synergy between Mitsubishi Chemical Group and Boston Materials is set to pave the way for groundbreaking advancements in semiconductor technology.
The first-generation Liquid Metal ZRT® product, known as LMZ1100, has already made waves in the industry with its proven ability to provide over 10°C cooling enhancement for kilowatt-scale, liquid-cooled ASICs and GPUs. This impressive performance not only optimizes thermal management but also ensures long-term reliability, making it suitable for high uptime applications. The product is also designed with high-volume manufacturing (HVM) integration in mind, which is critical for scaling production as demand continues to grow in the semiconductor landscape. The second-generation Liquid Metal ZRT product resulting from this collaboration promises even greater thermal efficacy and reliability, thereby addressing the growing needs of AI infrastructure. Anvesh Gurijala, CEO of Boston Materials, emphasized the significance of this partnership in expanding the reach of their innovative product while accelerating their development roadmap.
In line with this initiative, MCG plans to set up specialized labs for advanced semiconductor packaging integration and application development across Asia. This infrastructure will play a pivotal role in facilitating the commercialization and mass deployment of the Liquid Metal ZRT product across the Asia-Pacific (APAC) region, which is a hotbed for semiconductor innovation. This collaboration reflects Mitsubishi Chemical Group's strategic direction towards establishing itself as a premier player in high-performance, functional materials for the semiconductor industry. The prospect of enhanced thermal management capabilities through advanced materials will undoubtedly catalyze improvements in AI and HPC technologies, ultimately driving the next wave of innovation in the sector. This partnership stands as a testament to the importance of material innovation in overcoming the challenges faced by the semiconductor sector today, thereby ensuring continued growth and expansion in this critical industry. As both companies look forward to the future, it’s clear that the synergy between Mitsubishi Chemical Group and Boston Materials is set to pave the way for groundbreaking advancements in semiconductor technology.
Topics Business Technology）
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