#Japan #Tokyo #CMC Research #Silica Fine Particles #Shigeru Koshibe

Seminar on Silica Fine Particles: Applications and Roles in Advanced Fields

Organized by: CMC Research
Date: October 7, 2025, from 1:30 PM to 4:30 PM
Format: Live via Zoom (with material provided)
Instructor: Shigeru Koshibe, CEO of iPack

In this seminar, attendees will delve into the topic of silica fine particles, which play crucial roles across various sectors, from everyday materials to cutting-edge technologies such as optics and semiconductors. This seminar aims to present a comprehensive overview of silica fine particles, their fundamental properties, and their advanced applications, specifically focusing on their role in optical and semiconductor fields.

Why Attend?

Participants will gain valuable knowledge about:

• - General understanding of silica fine particles including usage, specifications, raw materials, and manufacturing methods.
• - Product states and precautions when handling silica fine particles.
• - The significance of silica fine particles in advanced fields like optics and semiconductors, including detailed discussions on silica fillers used in semiconductor encapsulation materials.

Seminar Target Audience

This seminar is ideal for:

• - Individuals interested in silica and its applications for both everyday and industrial use.
• - Those who wish to understand the role of silica in advanced fields such as semiconductors and optics.
• - Professionals seeking technical information on silica fillers used for semiconductor encapsulation materials.

Program Overview

The seminar will follow a structured program with a break, covering the following topics:
1. Applications of Silica Fine Particles
- Everyday products
- Industrial products
- Advanced products
2. Classification of Silica Fine Particles
- Raw materials
- Types
- Particle size
3. Manufacturing Methods for Silica Fine Particles
- Overview; powdered silica, suspension silica, manufacturing companies
- Methods; crystallization, melting, injection, combustion, smoke method, calcination, and refining
4. Properties and Testing Methods of Silica Fine Particles
- General properties
- Testing methods
- Powder properties
5. Surface Treatment of Silica Fine Particles
- Purpose
- Surface conditions
- Functionalization
- Treatment methods
- Evaluation methods
6. Dispersion Techniques for Silica Fine Particles
- Aggregation
- Dispersion and grinding
- Dispersion methods
- Evaluation methods for dispersibility
7. Roles and Examples of Silica Fine Particles in Advanced Fields
- Optical fields; refractive index adjustment, scattering, and reflection
- Semiconductor fields; ACF insulation materials, wafer processing materials (polishing, etc.), fillers for encapsulation materials

There will also be a question-and-answer segment to facilitate deeper engagement and clarify any uncertainties.

Speaker Profile

Shigeru Koshibe is the CEO of iPack, with an impressive career in the silica manufacturing and materials sector. He graduated from Osaka University’s Faculty of Engineering and has worked on semiconductor encapsulation materials and silica development at various companies. With over 200 seminars and numerous technical publications to his name, Koshibe brings a wealth of experience and knowledge to the seminar.

Registration Fees

• - General: 44,000 JPY (tax included)
• - Newsletter subscribers: 39,600 JPY (tax included)
• - Academic: 26,400 JPY (tax included)

To Register:
Please visit the CMC Research website to secure your spot; a viewing link will be provided via email upon registration.

Don't miss the opportunity to enhance your understanding of silica fine particles and their crucial roles in modern technology.