#Singapore #ER Engineering #SEMICON SEA

E&R Engineering Unveils Advanced Laser and Plasma Solutions at SEMICON SEA 2025

E&R Engineering Corp., a leader in semiconductor technology for over 30 years, proudly announces its participation in SEMICON Southeast Asia 2025, scheduled from May 20 to 22 at the Sands Expo & Convention Centre in Singapore. This pivotal event will spotlight the company's groundbreaking developments in advanced laser and plasma processing solutions that are set to redefine the standards in semiconductor equipment.

This year, E&R joins forces with Zen Voce and GP Group, making a formidable coalition for the exhibition. The collaboration brings together extensive expertise across the semiconductor landscape, from frontend to backend processes and automation. With a shared commitment to innovation and quality, the partnership embodies the philosophy that “1 + 1 + 1 > 3,” suggesting that their combined strengths will yield results far superior to individual efforts.

Highlighted Technologies by E&R

Plasma Dicing Solutions

E&R will present its hybrid plasma dicing solution, which integrates laser grooving and plasma cutting to accommodate ultra-thin die corridors (10-30 μm). The offering goes beyond mere equipment, as E&R also provides a turnkey dicing service that accurately handles unique shapes such as hexagons and circles, including multi-plane reconstruction configurations.

FOPLP – Panel Level Packaging Solutions

E&R's comprehensive solution for large panel processing includes laser marking, laser dicing, debris removal using lasers, plasma cleaning, and burr removal after drilling, with a remarkable warping control up to 16 mm. Enhanced by laser detachment and dry plasma etching solutions, the process facilitates efficient separation of glass substrates and panels.

Glass Substrate Solutions

As a leader in glass core processing equipment, E&R showcases a range of functionalities:

• - High-Productivity TGV Drilling: Capable of producing up to 1,000 VPS with a precision of ± 5 μm @ 3σ.
• - Laser Polishing: Ensures precise control of sidewall roughness.
• - Laser Beveling and Automated Optical Inspection (AOI): Provides defect detection with precision accuracy.

Advanced Packaging Solutions

E&R advances precision drilling for 2.5D/3D integrated circuits (±5 μm, with a B/T ratio of up to 90%) and provides hybrid laser and plasma solutions for cutting-edge TSV configurations. The laser marking system allows for multi-beam marking with a precision of ±25 μm, ensuring high throughput, alongside controlled thermal laser cutting services.

During SEMICON SEA 2025, attendees will witness how E&R, alongside Zen Voce and GP Group, is steering semiconductor manufacturing into the future by delivering solutions that are not only more accurate but also more efficient and integrated.

Trade Show Details

• - Booth Number: L2413
• - Location: Sands Expo & Convention Centre, Singapore
• - Event Dates: May 20-22, 2025
• - Website: E&R Engineering

E&R Engineering Corp. is excited to engage with industry stakeholders and demonstrate its latest technologies that serve to optimize semiconductor manufacturing processes. We invite all interested parties to visit our booth and explore the future of semiconductor solutions.