Boyd Showcases Liquid Cooling Innovations at Data Centre World London 2026

Boyd Corporation, a global leader in energy-efficient cooling solutions, is set to present its cutting-edge liquid cooling technologies at the upcoming Data Centre World London 2026. The event will take place from March 4-5, 2026, at ExCeL London, where Boyd will unveil its latest innovations tailored for AI data centers, colocation environments, and hyperscale operators.

With the rapid growth and demand for high-performance computing, Boyd has strategically positioned itself as a key player in the European market for advanced cooling infrastructures. At the event, attendees will have the opportunity to experience firsthand the capabilities of Boyd’s liquid cooling systems designed specifically for AI and high-performance computing (HPC) environments.

Technical Insights from Industry Experts

One of the highlights of Boyd's presence at Data Centre World will be a presentation by Ryan J. McGlen, CEng, PhD. Titled "Architecting the Data Center Cooling Circuit from 'Chip-to-Ambient'™", his talk will provide deep technical insights into the future of liquid cooling system design for AI-driven data center architectures. This session promises to shed light on the complexities and solutions needed to meet the rising demands of cooling technologies in modern data centers.

Reliability and Integration at the Core

AI data center operators face a pressing need for highly reliable liquid cooling systems that can be swiftly deployed and seamlessly integrated into existing architectures. Boyd excels in delivering next-generation liquid cooling systems, providing local design collaboration, equipment commissioning expertise, and long-term maintenance support. By doing so, Boyd helps reduce risks, enhance operational efficiency, and accelerate deployment timelines for its customers.

Boyd differentiates itself in the market with its vertically integrated manufacturing capabilities in Europe, ensuring rapid response times, greater flexibility, and a service-oriented commitment to operators looking to modernize their thermal infrastructure.

According to David Huang, President of Boyd's Thermal Solutions Division, “Boyd has the technology, engineering expertise, regional manufacturing capacity, and an end-to-end service framework necessary to support liquid cooling implementations in the burgeoning European market. Our clients rely on our dependable performance, responsive partnership, and our delivery of comprehensive liquid cooling solutions—from concept and design to commissioning and ongoing maintenance—all within the region.”

Engage with Boyd's Team

Participants at Data Centre World London are invited to visit Boyd's booth C193. Experts will be available to discuss liquid cooling systems specifically designed for AI and HPC, provide support for system-level integration, and highlight Boyd’s expanding capabilities across Europe.

About Boyd Corporation

Boyd is a trusted innovator globally, offering sustainable solutions that ensure customer products are better, safer, faster, and more reliable. Its advanced materials and thermal solutions drive technology forward, maximizing performance in some of the most advanced data centers worldwide. Boyd also improves reliability and range for electric and autonomous vehicles while enhancing the accuracy of cutting-edge personal health and diagnostic systems. Furthermore, Boyd supports critical aircraft and safety technologies and accelerates innovations in electronics and human-machine interfaces.

With a strong focus on sustainability, Boyd emphasizes environmentally friendly manufacturing practices with strategically located operations that minimize waste and reduce carbon footprints. The company fosters its workforce, unlocking potential and inspiring integrity and accountability in driving its clients' success.

For more information about Boyd and their innovative cooling solutions, visit www.boydcorp.com.