#South Korea #Tokyo #Samsung Electro-Mechanics #Sumitomo Chemical #Glass Core

Samsung Electro-Mechanics and Sumitomo Chemical Join Forces

On November 5, 2025, in a significant move towards enhancing the semiconductor landscape, Samsung Electro-Mechanics announced the signing of a memorandum of understanding (MOU) with Sumitomo Chemical Group. This partnership aims to establish a joint venture focused on the production of 'Glass Core,' a crucial material intended for next-generation package substrates. The collaboration between the two companies signifies a strategic approach to overcome technological challenges as artificial intelligence (AI) and high-performance computing (HPC) continue their rapid growth.

The Signing Ceremony

The ceremonial signing took place in Tokyo, Japan, and was attended by prominent figures including Chang Duckhyun, President of Samsung Electro-Mechanics, and Keiichi Iwata, Chairman of Sumitomo Chemical. Alongside other significant executives, they laid the groundwork for a partnership anticipated to make waves in the semiconductor packaging industry.

Understanding 'Glass Core'

'Glass Core' is envisioned as a key component for advanced semiconductor package substrates. Its advantages over traditional organic substrates include a lower coefficient of thermal expansion and enhanced flatness, which are critical for high-density, large-area semiconductor packages. In a world increasingly driven by AI advancements, the demand for such materials is expected to rise sharply.

Leveraging Collective Strengths

Through this joint venture, Samsung Electro-Mechanics, alongside Sumitomo Chemical and its subsidiary Dongwoo Fine-Chem, will combine their technological expertise and global presence to foster the manufacturing and distribution of 'Glass Core.' Samsung Electro-Mechanics will take on the lead role as the primary investor, holding a majority of the shares, while Sumitomo Chemical will join as a minority stakeholder. The two companies are set to finalize the details regarding shareholding structure, corporate name, and business timeline, with the intent to sign a comprehensive agreement in the upcoming year.

Future Plans

The headquarters of this joint venture will be established at Dongwoo Fine-Chem's Pyeongtaek location, which will also act as the initial production site for 'Glass Core.' As President Chang highlighted, the evolving landscape of AI technology underscores the increasing necessity for ultra-high-performance semiconductor packages. The 'Glass Core' is anticipated to redefine the future segments of this market.

Comments from Leadership

President Chang emphasized the importance of procedural synergy among the three partners, asserting that the collaboration stands to serve as a catalyst in the semiconductor package market's evolution. “This agreement provides an opportunity to combine the advanced capabilities of the three companies and establish a new growth engine in the next-generation semiconductor package market,” he noted.

Keiichi Iwata remarked on the partnership's potential to create substantial advantages in advanced semiconductor processes, indicating a commitment to fostering a long-term inclusive relationship through this collaboration.

Meanwhile, Lee Jongchan from Dongwoo Fine-Chem expressed excitement for contributing to the advanced semiconductor packaging landscape. He underlined the collective technological strengths of both companies, aiming to elevate their status in the sector.

Moving Forward

Currently, Samsung Electro-Mechanics is developing glass package substrate prototypes at its Sejong plant. Mass production is anticipated to scale up alongside the joint venture post-2027, ushering in a new era of semiconductor advancements. This collaboration not only represents a strategic partnership but also reflects the industry’s response to future technological needs, paving the way for innovative solutions tailored to the demands of an AI-driven future.

In summary, the joint venture between Samsung Electro-Mechanics and Sumitomo Chemical is a forward-thinking approach to semiconductor packaging that promises to transform industry standards and availability in the face of rapidly advancing technologies.