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ER Engineering Showcases Advanced Technologies at SEMICON Taiwan 2025

ER Engineering Corporation (TPE 8027) will unveil its latest laser and plasma technologies at SEMICON Taiwan 2025, emphasizing their impact on advanced packaging solutions. In an era where artificial intelligence (AI), high-performance computing (HPC), and 5G technology are transforming the semiconductor landscape, advanced packaging has emerged as a critical strategic area. Researcher Yole Group predicts that the advanced packaging market will surpass $50 billion by 2025, with an annual growth rate exceeding 15%, especially in fan-out panel level packaging (FOPLP).

ER Engineering’s contributions are vital in this evolving context. They will showcase a comprehensive range of solutions, including FOPLP, through-silicon vias (TSV), through-glass vias (TGV), and plasma cutting technologies. These integrated process technologies enable customers to achieve high input/output density, manage deformation control, and produce ultrafine features efficiently.

FOPLP Solutions

The company offers a complete suite of equipment for FOPLP applications, which includes laser marking, chip dicing, plasma cleaning, laser debonding, and ABF drilling. Their systems can accommodate panels of up to 700x700 mm and are designed with precision controls that maintain productivity while enabling stable processing of substrates with deformations of up to 16 mm.

TSV Applications

With the increasing demand for 3D packaging and advanced memory, TSV technology is essential for high-density integration. ER provides drilling, cleaning, and debonding solutions that blend both laser and plasma technologies, ensuring precise via profiles and reliable interconnections across various wafer sizes and materials.

Glass Substrate Solutions

In the emerging market for glass-core substrates, ER’s laser modification technology achieves an impressive via circularity of over 0.9, aspect ratios of 101, and rapid drilling rates of 1,500 vias per second. This solution is compatible with CoPoS and ABF substrate applications, facilitating high-performance manufacturing. Partnering with E-core, ER will also present a complete processing flow for glass substrates with metallization.

Comprehensive Packaging and Process Support

All ER Equipment is designed, manufactured, and certified in Taiwan, utilizing components from leading suppliers in the United States and Europe. The company has successfully shipped over 500 units worldwide, and their solutions are widely utilized in flip-chip ball grid array (FCBGA), fan-out, and wafer-level packaging by top OSAT and IDM providers. Additionally, ER has expanded its portfolio to include inverted chip BGA solutions, offering plasma cleaning for pre-flip chip interconnections, pre-molding, lower-filling cleaning processes, and laser marking for traceability. In 2025, ER introduced a fully automated high-power burning solution, compatible with testing environments up to 3,000 watts.

ER invites industry partners to visit their exhibit at SEMICON Taiwan to explore next-generation packaging and dicing technologies with their expert team.

SEMICON Taiwan 2025

• - Venue: Taipei Nangang Exhibition Center, Hall 1
• - Booth: 4F, #N0968
• - Dates: September 10-12, 2025
• - Website: ERSolutions

This showcase is not just about displaying technology; it's about shaping the future of semiconductor packaging as industries seek enhanced performance and reliability in their electronic products.