#Phoenix #Semiconductor #E&R Engineering

E&R Engineering Expands Semiconductor Operations with New U.S. Subsidiary

E&R Engineering Corp., a key player in the semiconductor laser and plasma equipment market, has officially launched its new subsidiary in Phoenix, Arizona, established in August 2025. This strategic move aims to bolster E&R's service capabilities and address the accelerating growth within the North American semiconductor sector.

A Decade of Investment in North America

E&R has been nurturing its presence in the North American semiconductor market for over ten years. With an anticipated addition of nine new customers in the coming year, the company forecasts maintaining a steady shipment workflow.

To augment local support, E&R plans to set up dedicated laser and plasma demonstration laboratories in both Phoenix and Portland by 2026. These facilities will enable local testing of samples and fine-tuning of process parameters, ultimately expediting development cycles and enhancing market entry speed.

Kevin Chang, the General Manager of ER USA, emphasized the company’s commitment. He stated, "With over a decade serving Tier-1 North American semiconductor customers, our global ER service team, which comprises more than 13 nationalities, offers unparalleled expertise and a deep understanding of our clients' operations. Our goal is to add nine new customers next year and expand our installation services into Canada."

Strategic Partnerships to Foster Growth

In conjunction with the new subsidiary's launch, E&R will partner with Taiwanese semiconductor firms to expand its reach into the global market. At the SEMICON West event in Phoenix (Booth #1561), E&R will showcase its innovative laser and plasma solutions, collaborating with over ten Taiwanese partners in the fields of semiconductor equipment, materials, and automation technologies. This highlights the advanced packaging expertise that Taiwan brings to the table.

Featured solutions at the event include:

• - Wet processes for coating, developing, and etching equipment.
• - RDL plating equipment.
• - High-power burn-in testing solutions.
• - TGV/TSV inspection systems.
• - Wafer-level electrical testing auto RS leakage measurement equipment.
• - Heat sink bonding and pressing apparatus.
• - Advanced Optical Inspection (AOI) equipment.
• - 310×310 mm/515×510 mm panel level PVD Equipment.
• - Precision machining services.
• - IC tray carrier tape design and manufacturing services.
• - International logistics and PCB/ABF sputter plasma equipment.
• - Semiconductor Automated Material Handling System (OHT/AMR/EFEM).

ER Select: A New Platform for Taiwanese Partners

To further solidify its commitment to the semiconductor industry, E&R has launched the