E&R Engineering Showcases Cutting-Edge Laser and Plasma Solutions at SEMICON SEA 2025

E&R Engineering Debuts Innovative Laser and Plasma Solutions at SEMICON SEA 2025



E&R Engineering Corp. is excited to announce its participation in SEMICON Southeast Asia 2025, scheduled to take place at the Sands Expo and Convention Centre in Singapore from May 20-22. With over three decades of dedication in the semiconductor industry, E&R will showcase its latest advancements in laser and plasma processing technology, pushing the boundaries of semiconductor equipment innovation.

This year, E&R is teaming up with two key partners, Zen Voce and GP Group, to form a dynamic joint exhibition team. Each company brings extensive expertise from various sectors of the semiconductor industry, covering front-end, packaging, back-end, and automation processes. This collaboration underscores a shared commitment to innovation and quality, embodying the belief that “1 + 1 + 1 > 3,” where the combined strength of three firms generates more than the sum of their individual contributions.

Featured Technologies from E&R


Plasma Cutting Solution for Small Die Cutting

E&R offers a hybrid solution that combines laser grooving and plasma cutting, enabling ultra-fine cutting lines ranging from 10 to 30 micrometers. In addition to providing equipment, E&R also features a turnkey cutting service, managing unique shapes such as hexagons, circles, or custom MPR designs with remarkable precision and consistency.

FOPLP – Fan-Out Panel Level Packaging (700 × 700 mm)

E&R's comprehensive solution supports large panel processing and includes laser marking, laser cutting, laser debonding, plasma cleaning, and post-punch depaneling, maintaining excellent deformation control of up to 16 mm. The process is further optimized with laser detachment and dry plasma etching solutions to separate the glass substrate from the panel efficiently.

Glass Substrate Solutions

E&R leads in core glass processing equipment, offering:
  • - High-Productivity TGV Drilling (600–1000 VPS, ±5 μm at 3σ)
  • - Laser Polishing for precise wall roughness control
  • - Laser Beveling and Automated Optical Inspection (AOI) for defect detection

Advanced Packaging

E&R provides high-precision laser drilling for 2.5D/3D integrated circuits (±5 μm, B/T ratio of up to 90%). Hybrid laser and plasma solutions are available for advanced Through-Silicon Via (TSV) applications, along with multi-beam laser marking delivering ±25 μm precision and high throughput, and controlled thermal laser cutting.

Join E&R Engineering at SEMICON SEA 2025 to witness how they, along with Zen Voce and GP Group, are driving the future of semiconductor manufacturing with more precise, efficient, and integrated solutions. Don't miss this opportunity to learn about the latest advancements that are shaping the industry landscape!

Exhibitor Information


  • - Exhibitor Number: #L2413
  • - Location: Sands Expo and Convention Centre, Singapore
  • - Dates: May 20-22, 2025
  • - E&R Website: E&R Engineering

Topics Business Technology)

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