#United States #San Jose #AI Infrastructure #Optical Interconnect #Wiwynn

Wiwynn Showcases Innovative AI Infrastructure at OCP 2026

Introduction

Wiwynn Corporation, a prominent provider of cloud IT infrastructure, made significant strides at the 2026 Open Compute Project (OCP) Global Summit in San Jose, California. The company unveiled its latest innovations including next-generation AI rack platforms, advanced thermal engineering techniques, and cutting-edge optical interconnect technologies. These advancements underscore Wiwynn's commitment to transforming the AI infrastructure landscape through holistic engineering solutions that encompass computing, cooling, power, and connectivity.

Unveiling the Next-Gen AI Rack Platforms

NVIDIA Vera Rubin NVL72 Rack

Wiwynn has emerged as one of the pioneering partners in NVIDIA's pilot for the Vera Rubin NVL72 platform. This groundbreaking rack-scale architecture integrates an impressive 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs, utilizing the 6th-generation NVIDIA NVLink technology. This innovative design promises unparalleled performance and energy efficiency tailored for intensive AI operations.

AMD Helios™ Rackscale Solution

The AMD Helios solution exemplifies a unified architecture ideal for large-scale AI training and inference. Leveraging AMD Instinct™ MI450 Series GPUs and 6th Gen AMD EPYC™ Server CPUs, this integration facilitates high-performance computing, addressing the growing demands of cloud service providers (CSPs). Wiwynn has put its operational expertise to use, ensuring that these technologies meet the specific needs of its clientele through tailored solutions.

Breakthroughs in Thermal Engineering

Recognizing the critical importance of efficient cooling in high-performance AI systems, Wiwynn has introduced a series of thermal innovations designed to overcome traditional cooling limitations.

Diamond-based Microchannel Cooling

Wiwynn is exploring the use of diamond-based composites as a revolutionary approach to on-package cooling. By utilizing diamond's exceptional thermal conductivity, the company aims to enhance heat transfer and provide superior cooling directly at the chip level, thus improving overall system performance.

6kW Double-Sided Cold Plate Design

The newly developed cold plate features an ultra-thin, double-sided design capable of delivering 6kW cooling capacity. This design not only enhances thermal performance by more than 15% but also reduces power delivery losses by up to 80%. Such innovations are essential for next-generation AI modules that demand robust thermal management solutions.

Lightweight Solutions for Enhanced Efficiency

Wiwynn demonstrates its commitment to eco-friendly design by minimizing material usage in cold plates and manifolds, achieving a weight reduction of at least 30%. This focus on lightweight components streamlines integration and transportation while supporting the increase in density for AI racks.

Advanced Cold Plate Designs

Collaboration with Corintis led to the development of topology-optimized microchannel cold plates specifically designed for high heat flux areas. This tailored approach improves both thermal and hydraulic performance, ensuring that the cooling solutions are aligned with the specific power requirements of AI ASICs.

Optical Interconnect Technologies and overcoming Network Bottlenecks

In addition to thermal technologies, Wiwynn showcased its co-packaged optics (CPO) solutions at the summit. Working alongside partners such as Ayar Labs, Corning, GUC, and Senko, Wiwynn is set to redefine rack-level optical interconnects through its comprehensive scale-up solutions.

Live Demonstrations of CPO Solutions

The summit featured a live demonstration of Wiwynn's optical engine telemetry, illustrating the seamless integration of optical, mechanical, and cooling systems. This open ecosystem approach showcases Wiwynn's unique capability to merge these components into a scalable AI infrastructure platform, addressing network bottlenecks effectively.

Conclusion

Wiwynn's impressive display at the 2026 OCP Global Summit highlighted its leadership and innovation in AI infrastructure technologies. From next-gen AI rack platforms to pioneering thermal and optical solutions, Wiwynn is dedicated to progressing the technological capabilities required for the future of AI. Attendees at the summit are encouraged to visit Wiwynn at Booth C74, participate in engaging workshops, and explore the latest whitepapers detailing next-generation AI solutions.

About Wiwynn

Headquartered in Taiwan, Wiwynn is dedicated to delivering high-performance computing and storage solutions. The company's commitment to innovation encompasses a wide range of technologies aimed at optimizing workload and energy use across numerous data center applications. With manufacturing facilities extending across Taiwan, the U.S., Mexico, Malaysia, and the Czech Republic, Wiwynn integrates advanced solutions to meet the demands of the cloud and edge computing environments effectively.