Obsidian Sensors Announces New SVGA Thermal Imaging Sensor with Enhanced Resolution and Cost Efficiency
Obsidian Sensors Introduces Cutting-Edge SVGA Thermal Imaging Sensor
Obsidian Sensors, a pioneering company in thermal imaging technology, has recently unveiled its latest product: the SVGA (800x600) thermal imaging sensor. This new sensor boasts a 17um pixel pitch and is manufactured on large glass substrates in collaboration with its partner Innolux, located in Jhunan, Taiwan. The company has made a remarkable advancement, increasing sensor resolution by over 50% in a short span of time by transitioning to the smaller pixel size, exemplifying a productive partnership with Innolux.
In an era where many competitors face challenges meeting cost-effective requirements for mass market adoption, Obsidian Sensors is taking a different approach. By utilizing its innovative manufacturing platform, the company can produce high-resolution sensors without raising consumer prices. The SVGA sensors are designed for efficiency and versatility, featuring a similar form factor to the previously successful VGA sensors already in the hands of global customers.
Obsidian Sensors aims to set the stage for unprecedented scalability and pricing in thermal imaging technology with the further addition of JDI (Japan Display Inc.) as a secondary manufacturing partner. The new SVGA microbolometer thermal sensor will be available for customers later this year, and there's even more in store. In 2026, the company plans to launch an SXGA (1280x1024) model at a 12um pixel pitch, designed for advanced applications including thermal imaging for dual-use robotics.
As CEO and co-founder John Hong elaborated, the transition to using large glass substrates for manufacturing thermal imaging products is groundbreaking. Many in the industry may be unfamiliar with the silicon versus glass substrate choices fundamental to thermal imaging technologies. However, Obsidian Sensors has successfully mitigated any technical uncertainties and turned its vision into reality with the mass production of reliable high-yield microbolometers built on these glass substrates.
The company’s roadmap continues beyond the SXGA model, with plans for Full HD (FHD) at 1920x1080 in 2027 and 4K resolution (3840x2160) in 2028. These enhancements will serve both commercial uses in sectors such as automotive, security, and industrial applications and critical defense scenarios utilizing commercial components.
Founded in 2017 as a spin-off from Qualcomm, Obsidian Sensors specializes in the creation and production of microbolometers via flat panel display manufacturing techniques. Their Large Area MEMS Platform (LAMP) employs surface micromachining integrated with high-performance low-temperature polysilicon thin film transistors (LTPS TFT). This innovative process allows for the fabrication of microbolometers and other microelectromechanical systems (MEMS) devices at the lowest possible cost and with impressive volume capabilities.
As the demand for high-quality thermal imaging technology rises, Obsidian Sensors is well-positioned to lead the industry forward with its groundbreaking solutions. Stay tuned for more updates on these transformative technology advancements that are sure to impact various sectors significantly.