#United States #San Jose #Ethernet Switch #CyberTAN #Pallas Series

CyberTAN Unveils Pallas Series Liquid-Cooled Ethernet Switch at OCP Global Summit 2026

On October 13, 2026, CyberTAN Technology, Inc., a recognized leader in enterprise networking solutions, made a significant announcement at the OCP (Open Compute Project) Global Summit in San Jose, California. The company introduced the Pallas Series architectural collaboration, aimed at overcoming the challenges associated with thermal and power efficiency in modern AI workloads.

Architectural Collaboration with Marvell

The launch of the Pallas Series revolves around a collaboration with Marvell, a well-known player in silicon technology. The new Ethernet switch platform architecture is specifically engineered to support the Marvell® Teralynx® T100 102.4 Tbps switch silicon. This collaboration aims to enhance the Power Usage Effectiveness (PUE) profile, a critical factor for data centers looking to achieve sustainability goals.

As the demand for generative AI and hyperscale workloads continues to grow, the need for efficient silicon and effective thermal management has never been more crucial. The Pallas Series is designed to leverage Marvell's cutting-edge 3nm technology, optimizing port density while capitalizing on the energy-saving capabilities that come with it.

Innovations in Cooling Technology

By integrating CyberTAN's proprietary Direct-to-Chip (D2C) liquid-cooled engineering with Marvell's silicon technologies, the Pallas Series can manage over 1,000 Watts of localized heat dissipation effectively. This innovative approach allows data centers to pursue elite-tier environmental sustainability goals without compromising on performance.

GwongYih Lee, Chairman and CEO of CyberTAN, remarked, “Our collaboration with Marvell represents a significant milestone in bringing high-capacity connectivity infrastructures to market. The Pallas Series is a step forward in empowering hyperscalers with network solutions that redefine PUE optimization and thermal management.”

Rishi Chugh, VP and General Manager at Marvell, echoed these sentiments, highlighting how the Pallas Series serves as a compelling example of how industry collaborations can tackle the challenges posed by traditional networking technologies.

Experience the Technology at OCP Global Summit

Attendees of the OCP Global Summit had the opportunity to experience the Pallas Series firsthand at Booth B29. A fully integrated architectural prototype, showcasing a complete schematic chassis, optical housing, and internal cabling, was on display. The implementation of a specialized thermal module allowed for simulations of real-world T100 silicon workloads.

A live dynamic demonstration of the liquid-cooling technology was showcased, utilizing a Coolant Distribution Unit (CDU) and equipped with multi-point temperature sensors. This setup successfully validated the Pallas Series' capability to manage significant workloads while maintaining an industry-leading PUE of 1.1 under testing conditions.

About CyberTAN Technology, Inc.

Founded in 1998, CyberTAN Technology, Inc. has emerged as a key player in the global networking equipment market. With its headquarters in Taiwan, the company has established a solid presence worldwide. CyberTAN specializes in developing advanced networking solutions, including broadband access and AI infrastructure tailored for hyperscalers and telecommunications operators. Their commitment to green technology and innovative engineering continues to empower businesses to achieve high efficiency and low-latency networking solutions for the AI era.

As the AI landscape evolves, innovations like CyberTAN's Pallas Series are poised to make a lasting impact on data center performance and sustainability, ensuring that the tech industry keeps pace with ongoing demands and expectations.