Broadcom and Samsung Strengthen Partnerships for Next-Gen AI Infrastructure

On August 25, 2026, Broadcom Inc. and Samsung Electronics Co., Ltd. announced significant expansion of their strategic collaboration in memory and foundry technologies aimed at supporting next-generation AI infrastructure. This milestone was revealed during the "AI Summit" held at The Midway in San Francisco, attended by key executives including Jinman Han, President and Head of Foundry Business at Samsung, and Hock Tan, President and CEO of Broadcom, alongside various government officials from South Korea.

The memorandum outlines an anticipated collaboration scale exceeding $200 billion within the next five years, through 2030, across both memory and foundry sectors. This ambitious projection highlights the increasing demand for top-tier semiconductor technologies essential for the evolving AI landscape.

In the realm of memory technology, the partnership aims to provide industry-leading memory solutions, including high bandwidth memory (HBM), specifically tailored for Broadcom’s next-generation AI accelerator semiconductor chips. This strategic collaboration will leverage both companies’ expertise to enhance data processing speeds and efficiency crucial for AI applications.

On the foundry side, cooperation will focus on Broadcom’s wireless broadband communication (WBC) solutions, utilizing Samsung's cutting-edge process technology, which operates at 2 nanometers (nm) and below. The partnership is set to expand into advanced packaging technology that supports higher performance semiconductors with reduced power consumption, incorporating Samsung’s 2nm technology in 2.3D and 2.5D integration.

Young Hyun Jun, Vice Chairman and CEO of Samsung's Device Solutions Division, commented, "The evolution of AI is generating unprecedented levels of demand for advanced semiconductor integration technologies that span across memory, logic, and advanced packaging. By enlarging our collaboration with Broadcom in these crucial areas, we aim to deliver greater value to our customers and contribute significantly to the future development of AI infrastructure."

Charlie Kawwas, President of Broadcom’s Semiconductor Solutions Group, also emphasized the increasing importance of tight collaboration within the semiconductor ecosystem amidst the ongoing expansion of AI infrastructure. He stated, "By combining Samsung’s strengths in memory and foundry with Broadcom’s leadership in AI and connectivity technologies, we will continue to offer solutions that support the next-generation AI infrastructure."

Samsung's unique capability in providing integrated semiconductor solutions that encompass memory, logic, foundry, and advanced packaging places the company in a strong position as the industry pivots towards the AI era. The expanded partnership with Broadcom stands as a demonstration of Samsung’s commitment to support customers through end-to-end semiconductor technologies that cater to the diversifying applications of AI and high-performance computing.

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