Longsys Introduces World's First Integrated-packaging mSSD for Enhanced Manufacturing Efficiency
In a remarkable stride for the technology sector, Longsys has unveiled its latest innovation, the integrated-packaging mSSD (Micro Solid State Drive). Launched under the transformative 'Office is Factory' model, this product is poised to redefine how solid-state drives are packaged and produced. The mSSD represents a leap forward in technology, combining high quality, efficiency, and cost-effectiveness all within a single, compact form.
The newly designed mSSD integrates essential components — the controller, NAND Flash, and Power Management Integrated Circuit (PMIC) — into a single System in Package (SiP). This significant change reduces the excessive solder joints traditionally found in printed circuit board assembly (PCBA) SSDs, which often lead to challenges such as contamination, interference between components, and deterioration of reliability due to environmental factors like heat and moisture. With the introduction of this innovative mSSD, the defect parts per million (DPPM) has been dramatically decreased from ≤1000 to an impressive ≤100, marking a tenfold improvement in production quality.
One of the most notable advantages of the mSSD is its streamlined manufacturing process. By consolidating all production steps into a one-step packaging method, Longsys has simplified the typical workflow which involves printed circuit board mounting, reflow soldering, and complex transfer stages. This innovative approach not only halves the delivery timeframe but also slashes production costs by more than 10%. Furthermore, the mSSD's design significantly curtails energy consumption and carbon emissions, aligning with the global push for sustainability within manufacturing practices.
Despite its incredibly compact dimensions of 20 × 30 × 2.0 mm and a weight of just 2.2 grams, this new mSSD robustly meets the PCIe Gen4×4 standards. Users can expect stellar performance with sequential read speeds reaching 7400 MB/s and write speeds at 6500 MB/s. Longsys has also prioritized thermal management in this design, employing a combination of high-conductivity aluminum alloy, graphene, and silicone to ensure that the mSSD operates reliably at full speed. This makes it an ideal solution for applications in high-demand environments such as AI hardware, gaming handhelds, drones, and virtual reality systems. Additionally, the power efficiency aligns with the NVMe L1.2 low-power specifications, ensuring it operates at consumption levels below 3.5 mW.
To enhance versatility, the mSSD supports both Triple-Level Cell (TLC) and Quad-Level Cell (QLC) NAND technology, with storage capacities ranging from 512GB to an impressive 4TB. The inclusion of a clip-on thermal expansion card provides tool-free conversion between M.2 2230, 2242, and 2280 form factors, allowing users to adapt the storage solution to their needs quickly. As a further enhancement, users have the option for on-site customization via inkjet or UV printing, which brings the 'Office is Factory' concept to actual practice.
The introduction of the mSSD underscores Longsys's commitment to revolutionizing storage technology not just for individual consumers but also for industrial clients. The integrated SiP design coupled with Longsys's agile manufacturing model empowers customers to achieve faster production timelines, reliable product quality, and efficient delivery. As always, Longsys stands firm in its vision, driving forward as a leader in innovation within the global storage technology landscape, promising smarter, greener, and more adaptable storage solutions for a variety of applications worldwide.
Established in 1999, Longsys has cultivated its position as a top-tier semiconductor memory enterprise, encompassing research and development, design, packaging, testing, manufacturing, and sales services. The company firmly upholds its vision of "Everything for memory," relentlessly pursuing memory technology advancements to offer high-end, flexible, and efficient customized services to its global clientele. For further details about Longsys's groundbreaking innovations, visit their official website and engage with them on LinkedIn and Facebook.
The newly designed mSSD integrates essential components — the controller, NAND Flash, and Power Management Integrated Circuit (PMIC) — into a single System in Package (SiP). This significant change reduces the excessive solder joints traditionally found in printed circuit board assembly (PCBA) SSDs, which often lead to challenges such as contamination, interference between components, and deterioration of reliability due to environmental factors like heat and moisture. With the introduction of this innovative mSSD, the defect parts per million (DPPM) has been dramatically decreased from ≤1000 to an impressive ≤100, marking a tenfold improvement in production quality.
One of the most notable advantages of the mSSD is its streamlined manufacturing process. By consolidating all production steps into a one-step packaging method, Longsys has simplified the typical workflow which involves printed circuit board mounting, reflow soldering, and complex transfer stages. This innovative approach not only halves the delivery timeframe but also slashes production costs by more than 10%. Furthermore, the mSSD's design significantly curtails energy consumption and carbon emissions, aligning with the global push for sustainability within manufacturing practices.
Despite its incredibly compact dimensions of 20 × 30 × 2.0 mm and a weight of just 2.2 grams, this new mSSD robustly meets the PCIe Gen4×4 standards. Users can expect stellar performance with sequential read speeds reaching 7400 MB/s and write speeds at 6500 MB/s. Longsys has also prioritized thermal management in this design, employing a combination of high-conductivity aluminum alloy, graphene, and silicone to ensure that the mSSD operates reliably at full speed. This makes it an ideal solution for applications in high-demand environments such as AI hardware, gaming handhelds, drones, and virtual reality systems. Additionally, the power efficiency aligns with the NVMe L1.2 low-power specifications, ensuring it operates at consumption levels below 3.5 mW.
To enhance versatility, the mSSD supports both Triple-Level Cell (TLC) and Quad-Level Cell (QLC) NAND technology, with storage capacities ranging from 512GB to an impressive 4TB. The inclusion of a clip-on thermal expansion card provides tool-free conversion between M.2 2230, 2242, and 2280 form factors, allowing users to adapt the storage solution to their needs quickly. As a further enhancement, users have the option for on-site customization via inkjet or UV printing, which brings the 'Office is Factory' concept to actual practice.
The introduction of the mSSD underscores Longsys's commitment to revolutionizing storage technology not just for individual consumers but also for industrial clients. The integrated SiP design coupled with Longsys's agile manufacturing model empowers customers to achieve faster production timelines, reliable product quality, and efficient delivery. As always, Longsys stands firm in its vision, driving forward as a leader in innovation within the global storage technology landscape, promising smarter, greener, and more adaptable storage solutions for a variety of applications worldwide.
Established in 1999, Longsys has cultivated its position as a top-tier semiconductor memory enterprise, encompassing research and development, design, packaging, testing, manufacturing, and sales services. The company firmly upholds its vision of "Everything for memory," relentlessly pursuing memory technology advancements to offer high-end, flexible, and efficient customized services to its global clientele. For further details about Longsys's groundbreaking innovations, visit their official website and engage with them on LinkedIn and Facebook.
Topics Consumer Technology）
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