#United States #San Francisco #AI Infrastructure #Broadcom #Samsung

Broadcom and Samsung Expand Their Strategic Cooperation

On August 25, 2026, Samsung Electronics (headquartered in South Korea) and Broadcom announced their intention to broaden their collaborative efforts in the fields of memory and foundry technology. The signing ceremony of this memorandum took place during the 'AI Summit' at The Midway in San Francisco, attended by notable figures including Jinman Han, President of Samsung Electronics and head of the Foundry Business Division, and Hock Tan, President and CEO of Broadcom, along with executives from both companies and representatives from the South Korean government.

Both companies anticipate that the scale of their collaboration in the memory and foundry sectors could exceed $200 billion within the next five years, leading up to 2030. The investment will focus on innovations critical to advancing AI technology.

In the realm of memory technology, Broadcom aims to deliver industry-leading memory solutions, including high-bandwidth memory (HBM), specifically designed for next-generation semiconductor chips like AI accelerators. This strategic partnership will enhance the development and deployment of high-performance memory technologies that are essential for AI applications.

In the foundry domain, Broadcom will utilize Samsung's cutting-edge 2-nanometer technology for its products, including wireless broadband communication (WBC) solutions. The collaboration is set to enhance specialized semiconductor technologies that are not only more powerful but also consume less energy, further advancing the realm of AI and networking.

Excitingly, the partnership will also expand into advanced packaging technologies, focusing on integrating systems using Samsung’s 2nm processes. The goal of integrating 2.3D and 2.5D techniques is to optimize performance and efficiency in semiconductor capabilities crucial for the AI sector.

Young Hyun Jun, Vice Chairman and CEO of Device Solutions at Samsung Electronics, commented, "The evolution of AI has generated unprecedented demand for advanced semiconductor integration technologies that encompass memory, logic, and cutting-edge packaging. By extending our cooperation with Broadcom in these critical areas, we aim to provide greater value to our customers and contribute to the future development of AI infrastructure."

The importance of close collaboration has heightened even further within the semiconductor ecosystem, particularly amid the continuous expansion of AI infrastructure. Charlie Kawwas, President of Broadcom’s Semiconductor Solutions Group, stated, "By combining Samsung's strengths in memory and foundry sectors with Broadcom’s leadership in AI and connectivity technologies, we will continue to deliver the technology needed to support next-generation AI infrastructure."

Samsung stands out with its comprehensive technological capabilities spanning memory, logic, foundry, and advanced packaging, positioning itself uniquely to provide integrated semiconductor solutions tailored to the AI era. The expansion of cooperation with Broadcom underscores Samsung's commitment to supporting its customers by offering end-to-end semiconductor technologies that span design to manufacturing in a diversified and evolving landscape of AI and high-performance computing applications.

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