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Smartkem Partners with Manz Asia for Advancements in AI Chip Packaging

In a bold move set to revolutionize the semiconductor industry, Smartkem (Nasdaq: SMTK) has announced a preliminary Joint Development Agreement (JDA) with Manz Asia, a prominent player in advanced packaging solutions for semiconductors. This collaboration focuses on the co-development of innovative dielectric ink solutions tailored specifically for AI chip packaging applications. As demand for AI computing surges, the need for advanced manufacturing techniques becomes paramount.

Smartkem, known for its pioneering transistor technology aimed at transforming electronics, intends to leverage this partnership to address major bottlenecks in advanced computer and AI chip packaging. Ian Jenks, the Chairman and CEO of Smartkem, expressed confidence in this collaboration, pointing to its progression as a natural continuation of their ongoing efforts with Manz Asia. Jenks noted, “This agreement reinforces our commitment to developing scalable, high-performance solutions that enhance AI chip packaging — an area that is becoming increasingly critical as more data centers deploy AI accelerators.”

A Shared Vision for Future Technologies

The genesis of this partnership stems from the successful demonstration of an advanced inkjet metalization process that took place at SEMICON® SEA 2025. This process showcased the potential of Smartkem's semiconductor materials in conjunction with Manz’s precision inkjet technologies, laying a foundation for the development of next-generation solutions. The primary goal is to elevate the efficiency of 12-inch wafer-level packaging and explore options beyond traditional wafer-based approaches into large-area panel packaging.

Robert Lin, General Manager of Manz Asia, emphasized the innovative capabilities brought forth through this JDA. He believes that combining Smartkem’s material science expertise with Manz's prowess in semiconductor manufacturing solutions will speed up the integration of dielectric ink technology into industrial practices. Lin stated, “The joint efforts are projected to yield enhanced scalability, improved resolution, and greater reliability in future chip integrations.”

Dielectric inks are essential in the back-end-of-line (BEOL) processes of semiconductor manufacturing, especially for top metal layer insulation and distributed layer (RDL) patterning. By using Smartkem’s advanced dielectric formulations, the partnership aims to foster high-resolution patterning and robust film integrity necessary for today’s intricate interconnect architectures.

Transforming Semiconductor Manufacturing

As the realm of AI computing expands, innovations in 12-inch wafer-level and panel-level packaging could redefine data center infrastructures. Shifting away from the restrictions of conventional methods allows for enhanced chip density, superior interconnect speeds, optimal thermal management, and eco-friendlier manufacturing practices. Smartkem and Manz recognize that the potential advantages stemming from these advancements are integral to the scalability of upcoming AI hardware.

Moreover, the JDA, while still in a preliminary phase, represents a significant milestone in the journey towards more efficient and cost-effective chip packaging solutions. However, it is essential to note that it is not legally binding, and there are no guarantees regarding the timing, terms, or completion of a definitive development agreement.

About Smartkem

Smartkem is on a mission to reshape the electronics landscape with groundbreaking transistor technology, utilizing proprietary advanced semiconductor materials. Their TRUFLEX® semiconductor polymers facilitate low-temperature printing processes, making them compatible with current manufacturing infrastructures. This innovation significantly lowers costs while enhancing performance across various display technologies—including MicroLED, LCD, and AMOLED—as well as advanced computer and AI chip packaging, sensors, and logic applications.

Operating from its R&D facility in Manchester, UK, Smartkem is actively commercializing high-performance display technologies. The company boasts an extensive intellectual property portfolio, comprised of 140 granted patents across 17 families and an additional 14 pending patents.

About Manz Asia

Manz Asia stands at the vanguard of semiconductor equipment manufacturing, emphasizing innovation and process excellence. Their expertise encompasses a wide array of solutions for semiconductor packaging, optimizing production and enhancing market competitiveness across various applications including Fan-Out Panel-Level Packaging (FOPLP) and Through Glass Via (TGV).

With this collaboration, both Smartkem and Manz Asia are poised to set new standards within the semiconductor manufacturing sector, ultimately paving the way for next-generation AI technologies. As they jointly explore the future possibilities, the semiconductor industry watches closely, anticipating significant innovations that could reshape the market landscape for years to come.