#Japan #Data Centers #Liquid Cooling #AI servers #Yamaguchi

Upcoming Webinar: Liquid Cooling Solutions

Background

With the rise of powerful GPUs that exceed 1000W of power consumption, traditional air cooling methods face limitations. The trend towards liquid cooling solutions has gained momentum globally, with data center facility designs advancing to accommodate this technology. This shift reflects the growing need for efficient thermal management strategies in AI applications that demand higher cooling efficiency.

Event Details

Organizer: CMC Research Co., Ltd.
Date: March 9, 2026
Time: 1:30 PM - 4:30 PM (JST)
Format: Live Streaming via Zoom (with presentation material included)

Seminar Theme

"Fundamentals and Applications of Liquid Cooling and Immersion Cooling Systems for AI Servers and Data Centers"
In this webinar, we will cover:

• - The principles of liquid cooling and immersion cooling principles beyond the limits of air-cooling.
• - Practical challenges and solutions related to heat transfer engineering and the impact of contact thermal resistance on cooling performance.

Costs

• - General Admission: ¥44,000 (tax included)
• - Newsletter Subscribers: ¥39,600 (tax included)
• - Academic Price: ¥26,400 (tax included)

What You Will Learn

Participants will gain insights into:

• - Basic principles of heat transfer engineering required for cooling design
• - Simplified cooling design methods utilizing heat transfer correlations
• - Comprehensive understanding of the concepts behind immersion cooling, including single-phase and two-phase cooling
• - Addressing thermal issues in electronic device implementation, like contact thermal resistance and heat spreaders

Target Audience

This session is ideal for anyone interested in cooling technologies for data centers, including engineers, researchers, and industry professionals.

Agenda Overview

1. Introduction
2. Differences in Performance between Air Cooling, Liquid Cooling, and Immersion Cooling
3. Simplified Thermal Design Methods using Heat Transfer Correlations
- Three forms of heat transfer
- Simplified thermal design methods for air/liquid cooling utilizing fans and pumps
4. Immersion Cooling for Electronics
- Single-phase cooling (e.g., oil immersion cooling)
- Two-phase immersion cooling
5. Other Thermal Challenges in Electronic Device Implementation
- Understanding Contact Thermal Resistance
- Insights on Heat Spreaders
6. Conclusion

Instructor Profile

Kazuhisa Yuki - Professor at Yamaguchi Tokyo University of Science
Dr. Kazuhisa Yuki has a wealth of experience in cooling high-density electronic devices, specializing in thermal resistance reduction techniques and thermal management in cooling systems at data centers and automotive applications.

Registration

Please register for the webinar through the CMC Research website. After registering, participants will receive a URL for viewing the session.

Don't miss this opportunity to enhance your understanding of advanced cooling technologies that are critical for today's AI and data center applications! For more information and to register, follow the link.

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• - Methanol Society Vision – Towards Carbon Neutrality (February 17, 2026)
• - Heat Dissipation/Cooling Technology for AI Data Centers (February 18, 2026)
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Stay updated on state-of-the-art technological trends and market information with CMC Research.