DB HiTek to Showcase Innovations at PCIM 2026, Expanding European Market Presence

DB HiTek Set to Attend PCIM 2026

DB HiTek, a recognized leader in the manufacturing of 8-inch semiconductor wafers, is gearing up for its participation at the Power Conversion and Intelligent Motion (PCIM) Europe 2026. The event is scheduled to take place from June 9th to June 11th in Nuremberg, Germany, and is anticipated to be a significant milestone in enhancing DB HiTek's presence in the European market.

Last year's PCIM proved to be a tremendous success for DB HiTek, where the company engaged in face-to-face discussions with numerous clients, exploring technological processes and potential collaborative opportunities. The exhibition attracted over 1,000 visitors at their booth, and the ongoing business discussions are expected to lead to tangible results as partnerships continue to develop.

This year, DB HiTek plans to unveil advancements in its next-generation SiC (Silicon Carbide) and GaN (Gallium Nitride) technologies. The company will also spotlight its industry-leading BCDMOS (Bipolar-CMOS-DMOS) technology, a key strength in its power management product portfolio. With a robust schedule of meetings planned with global clients, it is evident that DB HiTek is capitalizing on its momentum in the market.

According to market research by Yole Développement, the global market for SiC and GaN-based power semiconductors is projected to experience rapid growth. The SiC market, in particular, is forecasted to surge from approximately $4.8 billion in 2026 to $10.4 billion by 2030, showcasing a compound annual growth rate (CAGR) of 21%. Meanwhile, the GaN market is expected to grow from $900 million to $2.9 billion during the same period, corresponding to a remarkable 33% CAGR.

In December 2025, DB HiTek launched its Multi-Project Wafer (MPW) initiative for SiC and GaN processes, producing samples for more than ten customer products. These samples were delivered between March and April 2026 and are currently being assessed by clients, with their feedback to be incorporated into the final process verification. Full-scale production is planned for 2027.

Currently, DB HiTek maintains ongoing serial production relationships with around 400 clients, focusing primarily on its flagship power semiconductor products. Furthermore, the company collaborates with a diverse client base utilizing specialized image sensor technologies, including X-ray, Global Shutter, and SPAD (Single Photon Avalanche Diode). Application areas are increasingly shifting to industrial and automotive products, reflecting growing demand from these sectors.

The upcoming PCIM 2026 is expected to serve as a platform for DB HiTek not only to exhibit its innovations but also to strengthen existing relationships and forge new partnerships, ensuring its position at the forefront of the semiconductor industry in Europe and beyond.