#South Korea #Seoul #SK hynix #AI memory #CES 2026

Unveiling AI Innovations at CES 2026

SK hynix Inc., a renowned name in semiconductor manufacturing, is set to make a powerful statement at CES 2026 in Las Vegas, running from January 6 to 9. The company will introduce its latest AI memory solutions at a dedicated exhibition booth, under the theme 'Innovative AI, Sustainable Tomorrow.' This exciting showcase comes amid rising demands for cutting-edge memory technology in AI applications.

Highlights of the Exhibition

SK hynix will unveil its groundbreaking 16-layer HBM4 memory, which boasts an impressive 48GB capacity. This new product represents an evolution from the previous 12-layer HBM4 version, which only provided 36GB but achieved industry-leading speeds of 11.7 Gbps. The development of HBM4 has been strategically aligned with customer requirements, ensuring that it meets the performance benchmarks needed for advanced AI systems.

In addition to the high-bandwidth memory (HBM), SK hynix will also feature its 12-layer HBM3E product during the exhibition, which is expected to play a major role in the market throughout the year. Notably, the company plans to showcase GPU modules that integrate HBM3E for use in AI servers, thereby demonstrating its crucial function in AI infrastructures.

Moreover, the company is introducing SOCAMM2, a specialized low-power memory module designed specifically for AI server contexts. This addition not only diversifies SK hynix's product lineup but also highlights its commitment to addressing the burgeoning demand for efficient AI processing solutions.

Advancements in Conventional Memory Products

Beyond HBM, SK hynix will present an assortment of traditional memory products that have been optimized for AI applications. Among these is the LPDDR6, which is tailored for on-device AI operations. This generation promises substantial improvements in both data processing speeds and power efficiency when compared to earlier versions, firmly establishing SK hynix as a leader among its competitors.

The company's focus is not limited to memory solutions alone. In the realm of NAND flash, SK hynix will showcase its innovative 321-layer 2Tb QLC product, specially designed for ultra-high capacity embedded SSDs (eSSDs). As the demand for data center capabilities expands, this product stands out due to its superior power efficiency and unmatched performance improvement compared to previous QLC offerings, catering to the needs of AI data center environments.

Engaging the AI Community

A fascinated audience can also expect to explore the 'AI System Demo Zone', which will give visitors a firsthand opportunity to engage with SK hynix's cutting-edge AI system memory solutions prepared for the future. A key feature will be customized cHBM, specifically optimized for different AI chips or systems. This allows clients to visualize an innovative design approach that merges computation and control functions previously dependent on GPUs or ASICs.

Visitors can also learn about PIM (Processing In Memory) technology, designed to eliminate data movement bottlenecks commonly encountered in AI processing, while experiencing how AiMX (Accelerator-in-Memory based Accelerator) efficiently manages large language models (LLMs).

A Commitment to Customer Collaboration

Justin Kim, the president of the AI Infra team at SK hynix, emphasizes the ongoing evolution of technical requirements in the rapidly advancing AI landscape. With this in mind, he asserts the company’s dedication to delivering differentiated memory solutions that meet customer needs. By fostering close partnerships with clients, SK hynix aspires to create and share new value, fueling the growth of the global AI ecosystem.

In conclusion, SK hynix’s exhibition at CES 2026 is not just a showcase of products but a demonstration of their active engagement in shaping the future of AI technologies through innovative memory solutions. As the event unfolds, all eyes will be on their contributions to ensuring a sustainable and technologically advanced tomorrow.