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E&R Showcases Innovations at SEMICON Taiwan 2025

As the semiconductor industry evolves through advancements in AI, high-performance computing (HPC), and 5G technologies, packaging solutions have emerged as a critical focus area. E&R Engineering Corp. is joining the conversation at SEMICON Taiwan 2025, where they will unveil their latest laser and plasma technologies designed for advanced packaging solutions.

The Growth of Advanced Packaging

According to projections from the Yole Group, the advanced packaging market is expected to surpass USD 50 billion by 2025. With innovations like Fan-Out Panel-Level Packaging (FOPLP) gaining momentum, the industry is witnessing a robust annual growth rate exceeding 15%. This growth is further driven by increasing demand for high-density integration in semiconductor devices.

At SEMICON Taiwan, E&R will highlight their comprehensive range of solutions, particularly focusing on FOPLP, Through-Silicon Via (TSV), and Through-Glass Via (TGV) technologies. These innovations help meet challenges like high input/output (I/O) density, warpage control, and the manufacturing of ultra-fine features essential for modern electronics.

Comprehensive Solutions Offered by E&R

FOPLP Solutions: E&R Engineering is determined to empower customers with its extensive portfolio of equipment, which includes laser marking, dicing, plasma cleaning, laser debonding, and ABF drilling capabilities. The company’s sophisticated systems are engineered to support panel sizes up to 700 x 700 mm. They maintain high productivity while effectively managing substrate warpage of up to 16 mm, a critical component in the packaging process.

TSV Applications: With the onset of 3D packaging technologies and the necessity for higher memory integration, TSV has become pivotal for achieving high-density connections. E&R provides integrated solutions that encompass via drilling, cleaning, and debonding utilizing both laser and plasma technologies. This approach not only ensures greater accuracy in via profiles but also minimizes defects, thereby ensuring reliable interconnectivity across various wafer sizes and materials.

Innovations in Glass Substrate Technologies: In the rapidly emerging segment of glass core substrates, E&R has developed laser modifications that achieve extraordinary results—over 0.9 via circularity, 101 aspect ratios, and a staggering 1,500 vias per second drilling speed. These advancements are particularly advantageous for applications involving CoPoS and ABF substrates, promising both high performance and yield in production. E&R will also showcase an advanced metallization-enabled glass substrate process flow, developed in partnership with E-core partners, at the event.

Manufacturing Excellence and Global Reach

E&R Engineering prides itself on the quality of its manufacturing process; all equipment is designed, developed, and tested in Taiwan. Utilizing components sourced from leading suppliers in the U.S. and Europe, E&R has successfully shipped over 500 units globally, earning the trust of major Outsourced Semiconductor Assembly and Test (OSAT) companies and Integrated Device Manufacturers (IDMs) alike. Their innovative packaging solutions are widely utilized in FCBGA, FCCSP, fan-out, and wafer-level packaging applications.

Moreover, E&R has expanded its portfolio to include solutions such as Pre-Flip Chip BGA offerings, which feature Plasma Cleaning and Laser Marking for enhanced traceability. In this fast-paced industry, E&R's introduction of a fully automated high-power burn-in solution, capable of functioning in environments up to 3,000W, stands out as another significant milestone.

Visit E&R at SEMICON Taiwan 2025

E&R invites industry peers and stakeholders to explore next-generation packaging and dicing technologies. Their team of experts will be available for discussions and insights at SEMICON Taiwan, taking place at the Taipei Nangang Exhibition Center, Hall 1, from September 10 to 12, 2025. You can find them at Booth 4F, #N0968.

For further information, visit E&R Engineering Website.