#United States #Boston #OPROCESSOR INC #Photonic Interposer #VCSEL Technology

OPROCESSOR INC Unveils Revolutionary VCSEL-Based Photonic Interposer Technology

Introduction

In a groundbreaking announcement on September 16, 2025, OPROCESSOR INC revealed its cutting-edge VCSEL-based photonic interposer technology. This advancement addresses the crucial bottleneck in GPU-to-HBM interconnects, paving the way for next-generation artificial intelligence (AI) and high-performance computing (HPC) systems. The company's research was published in the journal Photonics on August 29, 2025, and they plan to showcase their innovation at the IEEE Photonics Conference 2025, scheduled for November 12-13 in Singapore.

Technological Breakthrough

OPROCESSOR’s innovative approach demonstrates, for the first time, the efficient coupling of multimode VCSEL light into non-silicon waveguides, including materials such as SiON, Si3N4, and SiO2. Utilizing a combination of prism coupling technology and an adhesive bonding method, the company has achieved ultra-low loss levels of 0.44 dB/cm propagation and only 0.76 dB coupling. This technology not only allows for scalable packaging but also incorporates polyimide micro-lenses to effectively collimate VCSEL light.

Another notable feature is the integration of a wavelength division multiplexing (WDM) filter at the prism base for efficient signal multiplexing, which enhances the capabilities of the photonic interposer.

Intellectual Property and Market Impact

The robust intellectual property portfolio of OPROCESSOR INC comprises four granted U.S. patents and three granted Korean patents, alongside pending applications covering their cutting-edge technologies. This IP strategy provides the company with a solid foundation for collaborations with global semiconductor leaders, ensuring their competitive edge in a rapidly evolving market.

Industry analysts project the global opportunity for photonic interposers to exceed $100 billion. This surge is largely driven by escalating demands in AI, HPC, and the burgeoning data center infrastructure, establishing a promising landscape for technological advancements.

• - Performance Metrics: OPROCESSOR's technology is designed to offer a staggering throughput of 200 Gb/s per lane with energy efficiency below 0.1 mW/Gb/s. The interposer enables multi-terabit bandwidth per package and is compatible with advanced packaging standards such as CoWoS and SoIC, in addition to future memory standards like HBM4 and HBM5.

Expert Insight

Dr. Sahnggi Park, the Technology Founder of OPROCESSOR INC and Principal Research Engineer at the Electronics and Telecommunications Research Institute (ETRI), emphasized the significance of this innovation: "This technology represents a pivotal step toward the commercialization of photonic interposers as the future standard for computing systems. Integrating photonics into the interposer level not only meets present-day requirements but also sets the stage for ultra-efficient AI and HPC architectures."

Company Overview

Founded in 2018 in Boston, Massachusetts, OPROCESSOR INC has established itself as a key player in the photonics sector, with an active research and development center located in Daejeon, South Korea. Led by CEO Kyungeun Kim, the company strives to harness the power of proprietary photonic interposer technologies developed by Dr. Park, creating cutting-edge solutions poised to change the landscape of high-performance computing.

Conclusion

The announcement from OPROCESSOR INC not only marks a significant technological advancement but also illustrates the increasing importance of photonics in shaping the future of computing. As the demand for faster and more efficient data processing continues to grow, innovations like those from OPROCESSOR INC will undoubtedly play a crucial role in the development of next-generation computing solutions.