Morse Micro Launches MM8108 Wi-Fi HaLow SoC for Next-Gen IoT Solutions

Morse Micro Launches MM8108 Wi-Fi HaLow SoC for Next-Gen IoT Solutions



On September 23, 2025, during The Things Conference, Morse Micro, a prominent player in the Wi-Fi HaLow market, announced the mass production of its innovative MM8108 System-on-Chip (SoC). This significant development is poised to transform the Internet of Things (IoT) landscape, promising unparalleled data throughput and enhanced communication range for a new era of IoT and edge AI applications.

A Leap Forward in Wi-Fi HaLow Technology



According to Michael De Nil, co-founder and CEO of Morse Micro, the MM8108 SoC signifies a breakthrough moment for IoT connectivity. He emphasized that with Wi-Fi HaLow technology, the company is not merely providing silicon components; they are laying the groundwork for IoT 2.0. This new paradigm will allow billions of devices to connect seamlessly, enabling cities, industries, and households to innovate and optimize their interactions with technology like never before.

The MM8108 SoC provides long-range Wi-Fi capabilities, reaching speeds up to 43 Mbps. Such performance opens the door for a fresh generation of low-power, long-range IoT devices that can support a plethora of applications from smart homes to industrial automation and beyond. This SoC is now fully produced, marking a significant milestone in the evolution of connected devices.

Comprehensive Evaluation Kits to Accelerate Development



In conjunction with the SoC’s release, Morse Micro is also rolling out a variety of Evaluation Kits (EVKs) designed to facilitate the development of new Wi-Fi HaLow applications. The first three kits include:
  • - MM8108-EKH01: This kit integrates the MM8108 SoC with Broadcom's BCM2711 SoC, utilizing a Linux-based Raspberry Pi 4 platform, allowing developers to create versatile solutions.
  • - MM8108-EKH05: Coupling the MM8108 SoC with ST Microelectronics's STM32U585, this kit runs on a FreeRTOS-based IoT platform, ideal for projects needing reliable and resource-efficient connections.
  • - MM8108-EKH19: Featuring the MM8108 SoC on a USB-A dongle, it connects to GLi.net's GL-MT3000 router with MediaTek's Wi-Fi 6 SoC, expanding connectivity possibilities further.

These kits are now accessible globally through Mouser Electronics, providing developers with robust tools to harness the full potential of Wi-Fi HaLow technology for IoT 2.0 solutions.

Expanding Module Availability to Meet Demand



With the commencement of mass production of the MM8108, Morse Micro is ramping up module availability to cater to increasing customer requirements. Multiple options are now available through various channels:
  • - MM8108-MF15457 Reference Module: Available on Mouser.com for public access.
  • - AzureWave's AW-HM677 Module: Directly available for high-volume customers from AzureWave, emphasizing reliability and performance at scale.
  • - Vantron's VT-MOB-AH-8108 Module: Designed to support low to mid-volume customer needs, with further production slated for later this year.
  • - Quectel Modules: Set for mass production within the same timeframe.

These collaborations enhance the capabilities of OEMs, enabling them to enter the market more rapidly while ensuring performance and reliability.

Introducing HaLowLink 2 for Easier Adoption



Morse Micro has also introduced HaLowLink 2, a next-gen evaluation platform enhancing the previous HaLowLink 1. This new platform upgrades the core SoC to the MM8108, facilitating higher throughput of 43 Mbps at extensive ranges. Set for general availability in Q1 2026, HaLowLink 2 aims to streamline the evaluation and deployment processes for Wi-Fi HaLow networks.

Configured to cater to a global market, including regions such as the United States, EU, UK, Canada, Japan, and Australia, HaLowLink 2 simplifies the integration and scaling of Wi-Fi HaLow technology.

Topics Consumer Technology)

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