#USA #Santa Clara #AIC Solutions #AI Inference Storage #Context Memory

AIC Unveils Advanced Storage Solutions for AI at FMS 2026

From August 4 to 6, 2026, the Santa Clara Convention Center served as the venue for FMS 2026, where AIC—a global leader in enterprise storage solutions—unveiled its latest innovations in storage for artificial intelligence (AI) inference and context memory. AIC’s exhibition at booth number 419 highlighted its cutting-edge products designed to handle increasingly complex AI workloads.

This year, AIC introduced its groundbreaking storage platforms that integrate advanced context memory. This innovative layer of flash memory is crucial for storing the context of precalculated models. This allows clusters of graphic processors to quickly retrieve context without the need to regenerate it, significantly enhancing performance.

Redefining Memory Hierarchy for AI Inference

A fundamental shift is occurring in the memory hierarchy for AI inference. Traditionally, the key-value cache—containing essential precalculated context—has exceeded the memory capacities of graphic processors. Consequently, operators are increasingly sourcing this context from shared NVMe flash storage instead of recalculating it on graphic processors. AIC's NVIDIA CMX platform exemplifies this new tier of shared flash memory, connecting via Ethernet, and acting as the bridge between graphic processor memory and capacity storage.

At FMS 2026, AIC showcased hardware designed to support this next-level memory architecture. Among the highlighted products were:

• - F2032-G6: An AIC 2U active-active flash storage system designed for context memory, compliant with PCIe Gen6 standards.
• - F2026-01-G5: A 2U PCIe Gen5 JBOF enclosure featuring dual-port NVMe connectivity, facilitating disaggregated flash storage for graphic processor clusters via NVMe-over-Fabrics.
• - HA2026-HC: A high-availability active-active storage platform engineered for workloads that require zero downtime during operations.
• - SB201-SU: A 2U 100% flash NVMe server equipped with dual Intel Xeon processors to streamline data ingestion and provisioning for AI applications.
• - J4078-02-04X: A high-density 4U JBOD SAS enclosure dedicated to backup, archiving, and data lakes that support the flash memory layer.

These offerings are a testament to AIC's comprehensive approach, demonstrating the capability to handle everything from petabyte-scale storage demands to proximity levels required by graphic processors.

Collaborative Innovations on Display

In collaboration with leading companies in the storage and AI ecosystem, including NVIDIA, Micron, and Silicon Motion, AIC’s products were featured across multiple booths at the FMS 2026. At Micron’s booth (#107), AIC’s F2032-G6 model was presented with Micron 6600 ION SSDs, while scale demonstrated AIC’s F2026-01-G5 model (#519).

Notably, H3 Platform showcased an accelerated storage and memory system at AIC’s booth. Developed together, their system integrates high-density NVMe solutions with PCIe orchestration, bringing data closer to the graphic processors for enhanced processing efficiency.

AIC's focus remains on continuously advancing in alignment with the evolving demands of AI workloads and reducing bottlenecks in storage architectures. The innovations presented at FMS 2026 signify AIC's ongoing commitment to developing robust systems that will meet tomorrow's AI workload challenges.

AIC's Ongoing Commitment to AI Storage Solutions

“We are always excited to participate in FMS, as it allows us to highlight our latest generation of storage solutions tailored for increasingly intense AI workloads,” stated Michael Liang, CEO of AIC. With over 30 years in the industry, AIC is positioned to continue growing alongside the AI sector, emphasizing its central role in AI storage.

CT Sun, AIC's CTO, explained the critical role of key-value caches in inference clusters, highlighting the need for maintaining the context readily available in shared flash memory close to graphic processors. He emphasized that effective implementation of these systems enables significant improvements in inference capabilities.

During FMS 2026, AIC invited attendees to visit booth 419 to experience firsthand the next generation of AI storage systems developed in collaboration with industry partners. Appointments with AIC experts were readily available for those interested in learning more.

Event Details

FMS 2026: The Future of Memory and Storage
Dates: August 4-6, 2026
Location: Santa Clara Convention Center
AIC Booth: #419
To schedule a meeting with an AIC expert during the event, email [email protected].

About AIC

AIC Inc. is a global leader in storage and server solutions, recognized for its innovation and quality in high-density storage solutions for over three decades. With a focus on AI storage and edge appliances, AIC aims to provide customizable products capable of meeting the dynamic needs of today’s data-driven world. Headquartered in Taiwan, AIC operates globally with offices across the US, Asia, and Europe. For further information, visit www.aicipc.com or contact [email protected].

Micron and its logo are registered trademarks of Micron Technology, Inc. NVIDIA is a registered trademark of NVIDIA Corporation. PCIe is a registered trademark of PCI-SIG. Intel and Xeon are registered trademarks of Intel Corporation. All other trademarks are the property of their respective holders.