SUNON Launches Advanced Liquid Cooling Technology at OCP Global Summit 2025

SUNON, a global frontrunner in thermal management solutions, has made waves at the OCP Global Summit 2025, showcasing its latest innovations in liquid cooling systems tailored for high-performance computing and AI-centric applications. Held in San Jose, California from October 13 to 16, this event serves as a platform for industry leaders to present and discuss next-generation technologies, and SUNON's participation emphasizes its commitment to driving advancements in thermal solutions.

The summit’s theme, "Build to Chill," reflects SUNON's dual focus on both innovation in cooling technologies and the reliability of their performance. According to SUNON's representatives, the focus on 'Build' denotes their mission of delivering cutting-edge cooling systems that cater to evolving market demands, while 'Chill' signifies the essential aspect of stability and reduced noise, ensuring that customers can trust their cooling systems in every setup.

Three Pioneering Innovations

Sunon has outlined three key innovations introduced at this year's summit, demonstrating their leadership in liquid cooling technology:
1. Open Loop Cold Plate Series: Designed specifically for Intel and AMD server CPUs, these open-standard cold plates enable superior performance across various server platforms. SUNON not only offers standard models but also provides customized solutions that can adapt to the specific needs and challenges faced by different industries.
2. Coolant Distribution Unit (CDU): A modular liquid-to-liquid CDU was launched, enabling a flexible configuration that simplifies maintenance and enhances functionality. This unit can be tailored to fit a variety of deployment scenarios, making it a versatile choice for customers seeking efficient thermal management solutions.
3. Closed-Loop Liquid Cooling Systems: SUNON's closed-loop systems feature various options to accommodate varying application requirements. This flexibility ensures that they meet the demands of industries that require highly specific cooling solutions, supporting the transition to more complex, liquid-cooled systems.

With over 45 years of expertise in the thermal solutions domain, SUNON leverages this extensive background to enhance its liquid cooling offerings. Their systems provide the essential balance between air and liquid cooling to help clients transition seamlessly to more powerful, liquid-cooled infrastructures.

Balancing Performance and Environmental Responsibility

SUNON emphasizes the importance of their thermal designs not just for performance but also for sustainability. By continuing to innovate in the realm of sustainable designs, SUNON is fostering an environment where high-efficiency computing meets ecological responsibility. Their latest products have been developed with future scalability in mind, assuring that organizations can confidently adapt to the ever-increasing demands of next-generation computing technologies.

During the exhibition, SUNON invites industry professionals, decision-makers, and members of the media to visit Booth A53 to explore firsthand how these pioneering liquid cooling technologies are shaping the future of data centers. This engagement aims to provide insights into how organizations can leverage advanced cooling systems to enhance their operational effectiveness while keeping sustainability at the forefront.

In summary, SUNON’s introduction of next-generation liquid cooling systems at the OCP Global Summit marks a significant advancement in thermal management technology, promising to pave the way for improved performance in AI and server computation environments. As high computing demands continue to rise, innovations like those from SUNON will play a critical role in supporting the future architecture of data centers worldwide.