Compal and ZutaCore's Breakthrough in AI Data Center Cooling Solutions

Advanced Cooling Systems for AI Data Centers

In the era of artificial intelligence, data centers are under increasing pressure to meet the surging power demands associated with high-performance computing. In response to these challenges, Compal Electronics and ZutaCore have ushered in a groundbreaking cooling solution designed specifically for AI workloads. This innovative collaboration was recently unveiled at Yotta 2025, where the partners showcased their integrated server and cooling technologies that promise to redefine efficiency and sustainability in data centers.

Highlighting the Collaboration

Compal, a frontrunner in producing high-performance AI server platforms, has partnered with ZutaCore, known for its waterless, direct-to-chip cooling technology. As Alan Chang, Vice President of Compal's Infrastructure Solutions Business Unit states, “Partnering with ZutaCore enables us to introduce transformative cooling technologies into our high-performance server offerings.” This collaboration not only improves the efficiency of data centers but also enhances the sustainability of operations, critical in today’s ecological climate.

ZutaCore's technology utilizes a two-phase liquid cooling system that is completely waterless and employs a non-conductive fluid. This innovative approach allows for the rapid removal of heat directly from the processor, addressing the cooling requirements of data centers that handle complex AI-driven tasks. My D. Truong, CTO of ZutaCore, emphasized the significance of this technology, explaining how it mitigates risks associated with traditional water-based systems, ensuring IT safety even under extreme conditions.

Showcasing Next-Generation Technologies

At Yotta 2025, attendees were introduced to two new platforms that exemplify the revolutionary capabilities of ZutaCore's HyperCool™ technology:

SG720-2A-L2 (7U 8-GPU UBB)

This robust system is engineered for next-generation AI acceleration, outfitted with AMD Instinct™ MI325X GPUs and designed to accommodate the upcoming MI355X models. With its flexible 850mm chassis, it effortlessly integrates into standard EIA 19-inch racks, while also supporting ORv3 infrastructure, a new standard aimed at enhancing hyperscale efficiency. The tool-less design allows for straightforward maintenance and upgrades, while its liquid cooling system achieves an impressive Power Usage Effectiveness (PUE) of between 1.04 and 1.1.

SD221-8A-L2 (2U 4-Node Dual Processor)

This platform sets a new bar for high-density computing with its advanced 2U4N architecture. It achieves an outstanding partial Power Usage Effectiveness (pPUE) of 1.01, measuring the efficiency at the rack level – an essential indicator of how much additional energy is necessary beyond the servers. Unlike conventional cooling solutions that risk condensation and corrosion, ZutaCore's system employs a dielectric fluid that is entirely safe for IT environments, thus prioritizing system reliability and operational integrity.

Benefits Beyond Expectations

ZutaCore’s innovative cooling technology ushers in several transformative benefits for data center operators:
1. Increased Performance: Allowing for more AI and HPC workloads within the same footprint enhances efficiency and maximizes resource utilization.
2. Reduced Energy Costs: By striving for PUE and pPUE figures as close to 1.0 as possible, operators can significantly cut energy expenses.
3. Enhanced Reliability: The elimination of condensation and corrosion risks ensures hardware longevity and consistent performance under intense workloads.
4. Sustainability: With drastically decreased energy and water consumption, this technology accelerates companies’ progress towards ESG targets.

A Forward-Looking Partnership

The partnership between Compal and ZutaCore signifies a vital shift towards more sustainable data center practices. With the rapid adoption of Edge AI, maintaining effective cooling solutions becomes essential for delivering real-time insights and intelligence. The collaboration points towards a future where data operations are not only more efficient but also environmentally responsible. Compal, established in 1984, continues to lead in various technological sectors, including cloud servers and smart devices, and this new focus on sustainable practices demonstrates their commitment to innovation in the tech industry.

In conclusion, the advancements showcased at Yotta 2025 underscore how industry leaders are adapting to meet the complexities of AI-driven workloads while emphasizing environmental sustainability. As global data demands continue to rise, the integration of efficient cooling systems will be paramount in facilitating this growth.