Raytron Microelectronics Launches Revolutionary Thermal Sensor for Global Imaging Advancements
Raytron Microelectronics Unveils OHLE 3123
A Breakthrough in Thermal Imaging Technology
On June 19, 2025, Raytron Microelectronics announced the launch of the OHLE 3123, marking a significant advancement in the field of infrared thermal imaging. This sensor, reportedly the first of its kind to utilize Super Wafer-Level Packaging (SWLP), aims to redefine the landscape of thermal imaging technology, moving beyond niche applications to broader consumer markets.
The Evolving Landscape of Infrared Technology
Historically, infrared thermal imaging technology was confined largely to specialized sectors due to high costs and limited availability of core components. Many manufacturers have dominated this market segment due to the extensive research and development investments and complex production protocols required for high-quality thermal sensors. However, with the introduction of the OHLE 3123, Raytron is poised to democratize access to this essential technology, enabling more companies to develop and manufacture their thermal imaging modules.
Innovative SWLP Technology
The SWLP technology integrated into the OHLE 3123 sets it apart from conventional thermal sensors. By employing a unique dual-layer encapsulation approach, Raytron has removed the need for cleanroom conditions during the production phase. This advancement not only enhances the manufacturing process but also supports compatibility with Surface Mount Technology (SMT²), promoting rapid mass production.
As a result, production costs are significantly reduced while maintaining high yield rates and dust resistance—two critical factors for manufacturers aiming at bulk procurement of infrared sensors.
Technical Specifications
The OHLE 3123 features a powerful vanadium oxide microbolometer array, delivering a resolution of 384 × 288 pixels with a 12 μm pixel pitch. With a Noise Equivalent Temperature Difference (NETD) of less than 40 mK and ultra-low power consumption of under 65 mW, this sensor strikes a fine balance between efficiency and performance. Its innovative design also allows for ease of integration in a variety of applications, including outdoor night vision, industrial temperature measurement, security surveillance, and automotive technologies.
Debuting at LASER World of PHOTONICS 2025
Raytron is set to showcase this revolutionary thermal camera sensor at LASER World of PHOTONICS 2025, taking place from June 24 to 27 in Munich, Germany. Attendees can experience the capabilities of the OHLE 3123 first-hand by visiting Raytron at Hall A2, booth #372. This event presents a prime opportunity for industry professionals to explore the future of thermal imaging technology and its potential to reshape multiple sectors.
The Future of Thermal Imaging
With its rich expertise in infrared, microwave, and laser technologies, Raytron is dedicated to delivering innovative solutions that add value to its customers. By empowering more companies with access to sophisticated thermal imaging modules through the OHLE 3123, Raytron is paving the way for advancements in multi-spectral sensing and artificial intelligence applications within thermal imaging frameworks.
For inquiries regarding OEM partnerships or bulk purchases, reach out to Raytron via email at [email protected] or visit their official website at https://en.raytrontek.com.
Raytron Microelectronics is committed to the continual evolution of thermal imaging technologies, ultimately aiming to enhance efficiency and accuracy across various industries worldwide.