#China #Shenzhen #Longsys #eMMC #AI Wearables

Longsys Revolutionizes AI Wearables with the Launch of 7.2mm eMMC

In the rapidly evolving world of wearable technology, every millimeter counts. As artificial intelligence continues to be embedded in these devices, the challenge for designers is to pack more functionalities into increasingly compact spaces. Recently, Longsys introduced a game-changing 7.2mm x 7.2mm subsize eMMC memory solution that redefines what is possible in terms of space efficiency for AI wearables.

Ultra-Compact Design: A New Era for Wearable Technologies

The new 7.2mm x 7.2mm eMMC is one of the smallest available on the market, engineered to provide maximum space efficiency. With 153 solder balls that nearly fill the entire panel, this design pushes the physical limits of memory technology. Compared to the conventional 11.5mm x 13mm eMMC, this new offering reduces surface area by about 65%, while maintaining a mere thickness of 0.8mm. Not only is it compact, but it also weighs only 0.1g—approximately 67% lighter than standard 0.3g eMMC modules. This remarkable weight and size reduction frees up space within wearable devices, enabling a more elegant design while accommodating additional components for greater functionality.

Performance and Capacity Achieved Through Innovation

Despite its small size, the 7.2mm x 7.2mm eMMC does not skimp on performance. Utilizing proprietary firmware, it ensures quick boot times and smooth performance of AI applications, while intelligent power-saving features, such as dynamic frequency scaling and sleep modes, help to extend battery life without sacrificing efficiency. Available in 64GB and 128GB capacities, it stands out in the market as one of the highest capacities for compact memory products, making it particularly suited for sophisticated devices like smart glasses, smartwatches, and earphones.

In-House Production: Unmatched Quality Control

What sets Longsys apart in the industry is its commitment to in-house packaging and testing. The subsize eMMC is produced at their state-of-the-art Suzhou packaging and testing facility, where innovative grinding and cutting processes ensure the component's minimal size. The facility specializes in NAND Flash and DRAM manufacturing, and is extending its capabilities to include eMMC, UFS, eMCP, and ePOP technologies, thereby offering a full spectrum of services across various packaging levels.

Full-Stack Customization: Meeting Diverse Needs

Longsys has positioned itself on the cutting edge of packaging technology, allowing for superior management of product size, heat dissipation, compatibility, reliability, and storage capabilities. The maturity of its eMMC offerings is evident; the launch of proprietary eMMC controllers and QLC eMMC products in 2024 are prime examples of this innovation. Their full-stack customization process, covering product development, technology integration, and manufacturing, caters to the diverse requirements of their clients.

Looking Ahead: Innovations on the Horizon

With the launch of the 7.2mm x 7.2mm ultra-compact eMMC, Longsys marks a significant breakthrough in maturation for memory products, paving the way for enhanced support in the development of AI wearables. As the company looks to the future, they remain dedicated to innovation in memory technology, promising to unlock more exciting possibilities within the wearable tech sector.

About Longsys

Founded in 1999, Longsys has established itself as a leading global semiconductor memory enterprise, dedicated to research, design, packaging, testing, and manufacturing. The company’s vision—“Everything for memory”—is complemented by its commitment to providing high-quality, flexible, and efficient full-stack custom services to clients around the world. For further information, visit Longsys and follow them on LinkedIn, Facebook, and Twitter.