#Taiwan #Zhubei #ERS electronic #Panel-Level Packaging

ERS Electronic Expands Footprint in Taiwan with New Demonstration Center

In a significant move to enhance its presence in the semiconductor manufacturing industry, ERS Electronic has officially opened a new demonstration center in Zhubei, Taiwan. This strategic development is aimed at directly catering to the burgeoning demand for panel-level packaging (PLP) in the region, which has been gaining momentum due to its operational advantages.

Meeting Industry Demand

The establishment of the Zhubei demonstration center showcases ERS Electronics' commitment to innovating and providing thermal management solutions. This facility will allow chipmakers and OSAT (Outsourced Semiconductor Assembly and Test) companies in Taiwan to gain direct access to the company's PhotoThermal debonding machine for wafers and panels, known as LUM600S1. This machinery is pivotal in streamlining the panel-level packaging processes crucial for modern semiconductor applications.

Panel-level packaging is rapidly evolving within the semiconductor industry, primarily due to its cost-effectiveness and process scalability. According to Dr. Yik Yee Tan, a principal analyst at Yole Group, the market is projected to surge from $160 million in 2024 to an impressive $600 million by the year 2030. This dramatic growth will primarily be driven by advancements in cost-efficient solutions within the advanced packaging sector.

Furthermore, as demand increases for larger chip sizes tied to high-density chiplet and heterogeneous integration applications, PLP is poised to become the go-to technology in the industry. In terms of efficiency, PLP offers a remarkable improvement in carrier area efficiency, boasting an increase of more than 80% compared to the traditional Wafer Level Packaging (WLP) methods, which only achieve about 45%.

Advancing Technological Capabilities

ERS Electronic has been a pioneer in the panel-level packaging sector, having introduced their first panel-level debonder back in 2018. Currently, the company boasts an expansive portfolio of both semi-automatic and fully-automatic systems designed to accommodate the diverse needs of the semiconductor manufacturing landscape. This includes the PhotoThermal debonding machines that facilitate temporary bonding and debonding (TBDB) processes, which are essential when working with ultra-thin substrates—key for high-performance computing (HPC) and artificial intelligence (AI) applications, such as CoWoS (Chip on Wafer on Substrate) and HBM (High Bandwidth Memory).

Sébastien Perino, Managing Director of ERS Taiwan, expressed enthusiasm for the new facility, stating, “With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness.”

Future Prospects

ERS Electronic's investment in the new demonstration center underscores its commitment to supporting local businesses in Taiwan as they navigate the fast-evolving semiconductor landscape. The accessibility to advanced technologies and direct support will undoubtedly empower these companies to leverage innovative efficiencies in their production processes.

For companies interested in exploring the capabilities of the LUM600S1 and other offerings at the Zhubei demonstration center, detailed information and testing opportunities can be found on ERS Electronic's official website, where regional sales representatives are ready to assist.

About ERS Electronic

Founded over 50 years ago, ERS electronic GmbH is renowned for delivering cutting-edge thermal management solutions to the semiconductor sector. Headquartered in Germering, Germany, the company's expertise spans various innovative solutions, including its highly acclaimed air cooling-based thermal chuck systems, which are widely utilized for wafer probing. Since entering the advanced packaging market in 2008, ERS Electronic has solidified its reputation by providing fully automatic and manual systems available on semiconductor manufacturing floors worldwide.