#Singapore #Advanced Packaging #Chiplet Integration #Silicon Box #Tampines

A Groundbreaking Achievement in Semiconductor Packaging

On October 15, 2025, Silicon Box, a frontrunner in chiplet integration and advanced semiconductor packaging, proudly announced its monumental achievement of shipping 100 million units from its state-of-the-art facility in Singapore’s Tampines Wafer Park. This facility, which began mass production in late 2023, focuses exclusively on advanced panel-level packaging (PLP) and stands as the largest in the world in terms of production capacity.

Silicon Box's innovative technology effectively addresses challenges related to performance, scalability, and costs associated with both wafer-level and traditional packaging schemes. Mike Han, the Head of Business at Silicon Box, stated, “Achieving breakthrough results in production at high volume is a significant milestone for Silicon Box, as well as for transitioning the industry towards more scalable and cost-effective design and manufacturing schemes.” These advancements are particularly crucial in meeting the rising demand for larger and more powerful devices essential for future technologies.

Exceptional Yield and Precision

One of the extraordinary aspects of this 100-million-unit shipment milestone is the impressive production yield attained at the Tampines facility, exceeding an industry-leading yield record of 99.7% at the wafer scale. JH Yee, Head of Operations at Silicon Box, commented, “The shipment milestone not only reflects our capability in executing advanced panel-level packaging at high volume but also showcases our very high yield.” Under the leadership of co-founder and CEO Dr. BJ Han, the team at Silicon Box has consistently pushed boundaries to deliver outstanding production results, producing millions of units daily.

The grand opening of the Tampines factory occurred in July 2023, with mass production commencing shortly thereafter. In 2024, this facility obtained ISO 9001:2015 certification and subsequently achieved ISO 14001:2015 and ISO 45001:2018 certifications in 2025. These certifications reinforce Silicon Box's commitment to quality, customer satisfaction, employee wellness, and sustainability practices.

Future Growth and Expansion Plans

With the successful shipment of 100 million units, Silicon Box is on track to meet its future capacity and production goals at its flagship facility, which is expected to reach full capacity installation by 2028. In addition, the company plans to establish a second manufacturing site in Novara, Piedmont, Italy, set to begin production in 2028. This new facility will replicate the production capacity of the Singapore plant while also providing native testing capabilities in Europe. Such developments will enable the creation of a comprehensive semiconductor value chain from design to final manufacturing and testing, catering to industries including artificial intelligence (AI), high-performance computing (HPC), automotive, mobile, Internet of Things, and robotics.

Mike Han emphasized the significance of these advancements: “As the only independent semiconductor packaging company with the ability to support chiplet architectures with high interconnection density at panel scale in mass production, our collaborations are yielding industry-leading results for our early customers, particularly in advanced automotive, robotics, and AI applications.”

He added that the economy of Silicon Box's large-format manufacturing approach allows a broader spectrum of customers and device applications to benefit from the most advanced packaging methodologies. Historically, potential clients often find costs prohibitive when dealing with other providers, but Silicon Box is changing the landscape by delivering innovative, cost-effective solutions.

About Silicon Box

Founded in 2021 by industry luminaries Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai, Silicon Box is at the forefront of advanced semiconductor packaging. The company specializes in high-performance chiplet integration and affordable alternatives to traditional packaging schemes. Leveraging over 30 years of experience and collaboration with leading partners, Silicon Box seeks to address the unique challenges associated with chiplet adoption and foster the growth of transformative technologies that shape the modern world. To explore more about Silicon Box, visit silicon-box.com/newsroom and silicon-box.com/timeline.

Conclusion

Silicon Box's achievement of shipping 100 million units is not merely a numerical milestone; it signifies the company's dedication to innovation and excellence in the semiconductor industry. By overcoming challenges and redefining the standards for advanced packaging, Silicon Box is poised to play a significant role in the technological advancements of the future.