#Japan #Tokyo #Thermal Management #AI Data Centers #CMC Research

Upcoming Live Seminar: AI Cooling Technologies for Data Centers

Hosted by: CMC Research (https://cmcre.com/)

Mark your calendars for an insightful live seminar on April 8, 2026, focusing on AI Data Center Cooling Technologies. As the demand for powerful AI computations grows, so does the energy consumption in data centers. Understanding the cooling methods vital for optimizing performance and ensuring sustainability is becoming increasingly important in today's technological landscape.

Seminar Details

• - Date: April 8, 2026 (Wednesday)
• - Time: 10:30 AM - 4:30 PM
• - Format: Live Zoom session (includes materials)
• - Instructor: Naoki Kunimoto, CEO of Thermal Design Lab, Inc.

About the Seminar

With the rise of AI applications like ChatGPT and DeepSeek, the energy requirements for data processing have surged dramatically. AI chips can generate heat exceeding 1 kW, making effective cooling one of the most significant challenges. Traditional air cooling methods are evolving towards liquid cooling, immersion cooling, and boiling cooling techniques to address this heat issue effectively.

This seminar covers:

• - The basics of heat transfer.
• - Effective thermal design knowledge in component and PCB design.
• - Heat design strategies for forced and natural convection devices.
• - Methodologies for designing heat sinks.

Who Should Attend?

This seminar is tailored for:

• - Electronics designers (implementation, mechanical design, circuit design, PCB design)
• - Developers of heat dissipation devices and materials
• - Quality assurance and quality control professionals

What You'll Learn

Participants will gain comprehensive knowledge including:

• - Trends in data volume and energy consumption due to advanced networking technologies
• - The implications of CASE and edge computing on heat generation in edge devices
• - Why thermal management has become critical in maximizing device functionality and performance
• - Detailed thermal design principles including conduction, convection, and radiation mechanisms

Outline of Topics

1. Trends in Energy Consumption: Explore how acceleration in AI computing influences heat generation and cooling requirements.
2. Fundamentals of Heat Transfer: Delve into the mechanics of heat analysis from both macro and micro perspectives
3. Cooling Solutions for High-Performance AI Servers: Understand GPU thermal output and the corresponding cooling approaches.
4. Components and Devices for Heat Dissipation: An overview of evolving heat sink technologies, heat pipes, and vapor chambers.
5. Current Challenges in Data Center Cooling: Examination of PUE goals and innovative cooling technologies.
6. Conduction Cooling of Edge Devices: Insight into structures of smartphones and base stations regarding their thermal management.
7. Selection of Thermal Interface Materials (TIM): Understanding various types of TIM and selection strategies.
8. Future Concerns in Thermal Management: Discussion on chiplet technology and its impact on energy efficiency.

How to Register

To participate, please register through the CMC Research seminar page. Upon registration, you will receive access details for the seminar via email.

Register here: Registration Link

We encourage all participants to engage actively during the Q&A session to maximize the potential learning experience from this session. Don’t miss this opportunity to enhance your understanding and skills in AI data center thermal management!

About the Lecturer

Naoki Kunimoto is the CEO of Thermal Design Lab, Inc. With his expansive experience in thermal design and cooling method development, he has contributed significantly to research in electronic device heat management and has authored several essential texts in this field.

Get ready to immerse yourself in innovative cooling technologies essential for the next generation of AI data centers. We look forward to your participation!

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For more upcoming webinars and information on various topics, visit CMC Research.