#Japan #Packaging #Tokyo #Semiconductor #CMC Research

Join the Semiconductor Packaging Technology Seminar

A highly anticipated online seminar titled “Basic Information on Semiconductor Packaging Technology: An In-Depth Explanation” will be held by CMC Research on April 10, 2026. The event is designed to provide detailed insights into the history of semiconductor packaging (PKG) development and material technology.

Seminar Details

• - Date and Time: April 10, 2026, from 10:30 AM to 4:30 PM (JST)
• - Platform: Zoom (materials included)
• - Instructor: Shigeru Koshibe, President of iPack Co., Ltd.
• - Registration Fees:

- General admission: ¥55,000 (tax included)
- Newsletter subscribers: ¥49,500 (tax included)
- Academic price: ¥26,400 (tax included)

This seminar aims to cover a wide range of topics including transfer molding, liquid encapsulation, compression molding, epoxy/silica design, and enhancing heat conductivity, all essential for practical implementation.

Key Topics Covered

• - Development history of semiconductor packaging (PKG)
• - Techniques and materials used in semiconductor packaging
• - Specifications of encapsulating materials, including raw materials, composition, manufacturing processes, and evaluation methods

Who Should Attend

This seminar is especially beneficial for:

• - Professionals involved in semiconductor packaging (sales, technology)
• - Individuals interested in semiconductor packaging technology
• - Those looking to deepen their understanding of encapsulation materials and technologies

The Importance of Semiconductor Packaging

In modern society, semiconductors serve as a foundational pillar, crucial for continuous industry growth. The protection of semiconductors through encapsulation paves the way for semiconductor devices to function effectively. Japan has been leading the market for over 40 years in packaging technology.

This seminar will focus on the historical development of semiconductor PKG alongside various encapsulating materials, consolidating knowledge for technology transfer. The instructor, Shigeru Koshibe, has extensive experience in the development of encapsulating materials and is one of the few technologists that are well-versed in practical packaging operations.

Coming Together to Learn

Participants will also have a chance to engage in a question and answer session, providing an excellent opportunity for practical application of knowledge. We encourage all interested parties to register and learn from this valuable seminar, which is not only informative but also vital for anyone working in the semiconductor field.

How to Register

To register for this seminar, please visit the official seminar site of CMC Research, and you will receive a URL for access via email. For more details, follow the link provided.

Register Here

Conclusion

Don't miss the chance to gain essential insights into semiconductor packaging technology from a leading expert in the field. This seminar could significantly benefit your understanding and career development in the semiconductor industry.