Raytron Microelectronics Unveils the OHLE 3123 Thermal Sensor
In a significant advancement for thermal imaging technology, Raytron Microelectronics has announced the release of the OHLE 3123, the world's first thermal sensor based on Super Wafer-Level Packaging (SWLP). This innovative product aims to redefine the landscape of infrared thermal imaging by making it more accessible and cost-effective for a myriad of applications.
The Evolving Landscape of Thermal Imaging
As the infrared thermal imaging technology continues to progress, there has been a notable reduction in the costs associated with infrared terminal products. Applications that were once limited to niche markets, such as night vision in automotive settings and industrial temperature measurement, are now rapidly expanding into mainstream consumer markets. However, the manufacturing of essential components like thermal imaging cores has been largely restricted to a few manufacturers due to the high costs of research and development, coupled with specialized production requirements.
Breaking Down Technical Barriers with SWLP
The OHLE 3123 is a groundbreaking thermal sensor that leverages Raytron's proprietary SWLP technology. This dual-layer encapsulation method eliminates the reliance on clean room environments, which are traditionally necessary for nanotechnology. Compatible with Surface Mount Technology (SMT), the OHLE 3123 facilitates rapid mass production, thereby significantly lowering production costs without compromising on dust resistance and performance—two critical factors for broad-scale infrared sensor acquisition.
Design Features of the OHLE 3123
The uncooled infrared focal plane array (FPA) of the OHLE 3123 is powered by an array of vanadium oxide (VOx) microbolometers, offering impressive resolution features of 384 x 288 pixels and a pixel pitch of 12 μm. With a net emission density (NETD) of less than 40 mK and extremely low energy consumption (below 65 mW), this sensor represents a significant leap forward in thermal imaging technology. Coupled with its compact design and superior image quality, the OHLE 3123 is poised to become the ideal thermal camera sensor for applications such as outdoor night vision, industrial temperature monitoring, and security surveillance.
Upcoming Showcase at LASER World of PHOTONICS 2025
Raytron Microelectronics will debut the OHLE 3123 at the LASER World of PHOTONICS 2025, taking place from June 24 to June 27 in Munich, Germany. Attendees are encouraged to visit Pavilion A2, Booth No. 372 for a firsthand look at this revolutionary thermal imaging technology and to request samples. Raytron is dedicated to creating added value for their clients through technological advancements and offers a wealth of experience in infrared, microwave, and laser technologies. Alongside their primary camera core modules, the company provides infrared sensors to a global clientele, driven by deep expertise in multispectral detection and AI algorithm development.
For collaborations with OEMs or bulk inquiries, please email
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Conclusion
The introduction of the OHLE 3123 thermal sensor marks a pivotal moment in the thermal imaging industry. With its innovative SWLP technology, Raytron Microelectronics not only aims to bring down costs but also to empower more companies to develop and manufacture essential thermal imaging modules, thus expanding the utility and reach of infrared technology in various sectors.