Exploring Semiconductor Packaging Fundamentals and Latest Trends in Quality Management

Upcoming Seminar on Semiconductor Technology

Seminar Overview

The upcoming seminar organized by CMC Research focuses on the critical aspects of semiconductor packaging, emphasizing foundational knowledge and quality management insights. This event is scheduled for December 25, 2025, from 10:30 AM to 4:00 PM and will be held via Zoom, complete with relevant materials for enrolled participants.

Keynote Speaker

The seminar will be led by Kazuo Ikenaga, a prominent expert from Success International Co., who has extensive experience in semiconductor technologies and has worked as a consultant and lecturer in various semiconductor seminars.

Seminar Details

- Date: Thursday, December 25, 2025
- Time: 10:30 AM - 4:00 PM
- Platform: Zoom (materials included)
- Registration Fees:

- General: 55,000 JPY (including tax)
- Newsletter Subscribers: 49,500 JPY (including tax)
- Academic Price: 26,400 JPY (including tax)

Register here for details and to secure your spot!

Learning Outcomes

Participants will gain a comprehensive understanding of the requirements for packaging functions, the evolution of packaging technologies, and essential knowledge of quality management in packaging. By understanding these concepts deeply, attendees will be better equipped to appreciate the structure, relevance, and connections within the packaging processes.

Moreover, insights into the latest challenges in packaging technologies will aid in future developments concerning materials and devices. The seminar aims to enhance inter-industry communication and collaboration.

Target Audience

This seminar is designed for:

- Young engineers specializing in packaging technologies
- Technical and sales personnel from device and material manufacturers
- Marketing professionals looking to broaden their semiconductor-related knowledge

Anyone with an interest in acquiring comprehensive knowledge and skills related to semiconductor technologies is encouraged to attend.

Seminar Program Structure

The full agenda includes:
1. Understanding Semiconductor Packaging
- Functions and types of packaging
- Evolution and structural elements of packages
2. Assembly Process of Packages
- Examination of assembly steps and their challenges; including back grinding, dicing, die bonding, wire bonding, and more
3. Quality Management in Packaging
4. Current Trends in Packaging Technologies
- Detailed discussions on WLP, FOWLP, SiP, TSV, and 3D packaging technologies
5. Conclusion and Q&A Session

Speaker Introduction

Kazuo Ikenaga has previously engaged in the development and production of semiconductor packages at Sony Corporation, where he held several significant roles including department head. Following his tenure at Sony, he joined Success International Co., where he continues to educate others on packaging technologies.

Registration Instructions

Interested individuals can register for the seminar through CMC Research's official site. After registering, attendees will receive a viewing link via email. Please review the recommended environment for Zoom sessions prior to participation.
Enroll now to learn more about semiconductor packaging!

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