Innovative Approaches to NVM and Embedded Chip Security in Computing
In a world increasingly dominated by the Internet of Everything (IoE), the demand for sophisticated chip designs has surged tremendously, particularly due to the growing influence of artificial intelligence (AI) that paves the way for the Artificial Intelligence of Things (AIoT). Michael Ho, the President of eMemory Technology Inc., elucidates how his company is pioneering solutions to address memory and security hurdles in this fast-evolving landscape. The complexity associated with high-performance computing applications necessitates powerful CPU cores and vast memory capacity, allowing chips to retain essential information even when not powered on.
During an enlightening discussion with EE Times Asia, Ho remarked that mobile devices, laptops, and cloud data centers rely greatly on advanced chips to enhance performance and efficiency. The requirements in high-performance computing (HPC) and AI applications necessitate chips capable of processing substantial datasets swiftly and reliably. eMemory has positioned itself as a key player in the non-volatile memory (NVM) intellectual property sector, focusing on what Ho terms multimemory development. The company's diverse product portfolio includes One-Time Programmable (OTP) memory options like NeoBit and NeoFuse, as well as Multiple-Time Programmable (MTP) choices like NeoEE and NeoMTP. Notably, eMemory is also developing a Physical Unclonable Function (PUF)-based security solution alongside their proprietary embedded flash memory, NeoFlash.
However, as the semiconductor industry advances, it faces escalating challenges in both manufacturing processes and chip architecture. Ho pointed out that achieving optimal performance necessitates strategic adjustments to manage electron flow while minimizing leakage, which could potentially compromise power efficiency and reliability. "To align our NVM technology with the demands of advanced applications, we aim to enhance our capabilities to work with advanced processes while simultaneously addressing the complexities inherent in these processes," stated Ho.
Specifically, the NeoFuse technology represents an advanced anti-fuse OTP solution, recently honored with the Best IP/Processor of the Year award at the EE Awards Asia 2024. It adeptly addresses the industry's challenges associated with scaling down to advanced technology nodes without incurring additional costs or complexity in design. As the transition to 5nm technology looms, the rated supply voltage of components reduces from 1.8V to 1.2V. NeoFuse conquers this hurdle by employing an innovative circuit that escalates internal voltage to three or four times higher while assuring device reliability, accommodating temperatures of up to 150°C in sub-5nm processes.
Furthermore, NeoFuse integrates parity bits in each word, empowering clients to adopt Error Correction Code (ECC) schemes that safeguard data integrity, rendering it an ideal contender for high-reliability System-on-Chip (SoC) applications, including those in the automotive sector. Its strategic design sets it apart from traditional eFuse options by rendering the physical variances between programmed and unprogrammed cells indistinguishable, providing a more secure alternative. NeoFuse's unique 3T structure incorporates a regulating transistor to bolster yield, reliability, and programming success, adding efficiency to the testing process and ultimately providing compatibility with standard logic processes.
Amid the pressing requirements for substantial SRAM capacity in high-end applications, eMemory has recently engaged in a partnership with Siemens to enhance SRAM repair capabilities, thereby integrating NeoFuse OTP technology with Siemens' Tessent MemoryBIST tool. This collaboration aims to streamline the usability of SRAM repair tools, responding to the evolving landscape of SRAM demands following compact chip designs. Ho highlighted Siemens' dominant market share, indicating the strategic importance of this collaboration.
Security remains a paramount concern among chip designers, as the complexity of today's applications necessitates robust protection against sophisticated cyber threats, particularly in sectors such as automotive, fintech, industrial automation, and personal electronics. The threat landscape has evolved, now leveraging advanced AI technologies, including generative AI, to create malicious attacks on devices. According to MarketsandMarkets, the embedded security market is projected to grow from $7.4 billion in 2023 to approximately $9.8 billion by 2028, reflecting a heightened focus on designing secure interconnected devices that protect sensitive data. eMemory's subsidiary, PUFsecurity Corp., is taking significant steps to address these security needs through innovative solutions like NeoPUF technology, which promises near-ideal performance.
PUFtechnology generates unique passwords for each chip, contributing to the creation of root keys and unique identification codes, securely stored within NeoFuse OTP. The incorporation of a True Random Number Generator (TRNG) ensures high-quality random number generation for diverse security operations. PUFsecurity also introduced the One-Stop Shop Security Platform in 2023, featuring revamped controllers and interface designs that facilitate better adoption and verification processes.
The collaboration between PUFsecurity and Arm has resulted in a security framework that integrates PUF technology with Arm Corstone-300, achieving significant certifications that enhance both security and functionality. Clients are increasingly opting for PUFtechnology to bolster their hardware security, further amplifying eMemory’s strategic edge in the market. Moreover, the company is committed to further enhancing its security offerings, continually adapting to meet the stringent demands for chip security, particularly within the data center segment. Technologies like PUFrt and PUFcc will be pivotal in addressing these security challenges as more customers seek compliance with open standards such as Caliptra, aimed at establishing secure silicon roots of trust crucial for data center applications.
Looking ahead, Ho envisions substantial growth for eMemory as it endeavors to qualify NeoFuse for 3nm processes and ambitiously includes future engagement with 2nm technology. PUFsecurity plans to introduce PUFhsm tailored for automotive applications that enable integrated security goals across varied chip functionalities. Ho concludes with optimism for future advancements, emphasizing the collaborative strength of eMemory and PUFsecurity in pioneering innovations in semiconductor technology.
During an enlightening discussion with EE Times Asia, Ho remarked that mobile devices, laptops, and cloud data centers rely greatly on advanced chips to enhance performance and efficiency. The requirements in high-performance computing (HPC) and AI applications necessitate chips capable of processing substantial datasets swiftly and reliably. eMemory has positioned itself as a key player in the non-volatile memory (NVM) intellectual property sector, focusing on what Ho terms multimemory development. The company's diverse product portfolio includes One-Time Programmable (OTP) memory options like NeoBit and NeoFuse, as well as Multiple-Time Programmable (MTP) choices like NeoEE and NeoMTP. Notably, eMemory is also developing a Physical Unclonable Function (PUF)-based security solution alongside their proprietary embedded flash memory, NeoFlash.
However, as the semiconductor industry advances, it faces escalating challenges in both manufacturing processes and chip architecture. Ho pointed out that achieving optimal performance necessitates strategic adjustments to manage electron flow while minimizing leakage, which could potentially compromise power efficiency and reliability. "To align our NVM technology with the demands of advanced applications, we aim to enhance our capabilities to work with advanced processes while simultaneously addressing the complexities inherent in these processes," stated Ho.
Specifically, the NeoFuse technology represents an advanced anti-fuse OTP solution, recently honored with the Best IP/Processor of the Year award at the EE Awards Asia 2024. It adeptly addresses the industry's challenges associated with scaling down to advanced technology nodes without incurring additional costs or complexity in design. As the transition to 5nm technology looms, the rated supply voltage of components reduces from 1.8V to 1.2V. NeoFuse conquers this hurdle by employing an innovative circuit that escalates internal voltage to three or four times higher while assuring device reliability, accommodating temperatures of up to 150°C in sub-5nm processes.
Furthermore, NeoFuse integrates parity bits in each word, empowering clients to adopt Error Correction Code (ECC) schemes that safeguard data integrity, rendering it an ideal contender for high-reliability System-on-Chip (SoC) applications, including those in the automotive sector. Its strategic design sets it apart from traditional eFuse options by rendering the physical variances between programmed and unprogrammed cells indistinguishable, providing a more secure alternative. NeoFuse's unique 3T structure incorporates a regulating transistor to bolster yield, reliability, and programming success, adding efficiency to the testing process and ultimately providing compatibility with standard logic processes.
Amid the pressing requirements for substantial SRAM capacity in high-end applications, eMemory has recently engaged in a partnership with Siemens to enhance SRAM repair capabilities, thereby integrating NeoFuse OTP technology with Siemens' Tessent MemoryBIST tool. This collaboration aims to streamline the usability of SRAM repair tools, responding to the evolving landscape of SRAM demands following compact chip designs. Ho highlighted Siemens' dominant market share, indicating the strategic importance of this collaboration.
Security remains a paramount concern among chip designers, as the complexity of today's applications necessitates robust protection against sophisticated cyber threats, particularly in sectors such as automotive, fintech, industrial automation, and personal electronics. The threat landscape has evolved, now leveraging advanced AI technologies, including generative AI, to create malicious attacks on devices. According to MarketsandMarkets, the embedded security market is projected to grow from $7.4 billion in 2023 to approximately $9.8 billion by 2028, reflecting a heightened focus on designing secure interconnected devices that protect sensitive data. eMemory's subsidiary, PUFsecurity Corp., is taking significant steps to address these security needs through innovative solutions like NeoPUF technology, which promises near-ideal performance.
PUFtechnology generates unique passwords for each chip, contributing to the creation of root keys and unique identification codes, securely stored within NeoFuse OTP. The incorporation of a True Random Number Generator (TRNG) ensures high-quality random number generation for diverse security operations. PUFsecurity also introduced the One-Stop Shop Security Platform in 2023, featuring revamped controllers and interface designs that facilitate better adoption and verification processes.
The collaboration between PUFsecurity and Arm has resulted in a security framework that integrates PUF technology with Arm Corstone-300, achieving significant certifications that enhance both security and functionality. Clients are increasingly opting for PUFtechnology to bolster their hardware security, further amplifying eMemory’s strategic edge in the market. Moreover, the company is committed to further enhancing its security offerings, continually adapting to meet the stringent demands for chip security, particularly within the data center segment. Technologies like PUFrt and PUFcc will be pivotal in addressing these security challenges as more customers seek compliance with open standards such as Caliptra, aimed at establishing secure silicon roots of trust crucial for data center applications.
Looking ahead, Ho envisions substantial growth for eMemory as it endeavors to qualify NeoFuse for 3nm processes and ambitiously includes future engagement with 2nm technology. PUFsecurity plans to introduce PUFhsm tailored for automotive applications that enable integrated security goals across varied chip functionalities. Ho concludes with optimism for future advancements, emphasizing the collaborative strength of eMemory and PUFsecurity in pioneering innovations in semiconductor technology.
Topics Consumer Technology）
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