#USA #San Jose #InPsytech #UCIe 3.0 #Egis Technology

InPsytech Unveils Cutting-Edge UCIe 3.0 Technology

InPsytech, a subsidiary of Egis Technology (6462.TWO), is set to demonstrate its innovative UCIe 3.0 technology of 3 nm at the Open Compute Project (OCP) Global Summit 2025. This premier event will take place from October 13 to 16, 2025, at the San Jose Convention Center in California. The presentation will highlight InPsytech's latest high-speed interface technology, which is entirely compatible with the new UCIe 3.0 standard, featuring 3D packaging integration and exceptional low-power performance. This development underscores InPsytech's significant research and development capabilities in chiplet interconnection technology.

The UCIe technology from InPsytech is designed to support advanced process nodes, optimally running from 22 nm to 2 nm, with heightened capabilities for 3 nm production. This technology can achieve data transfer speeds of up to 64 GT/s while providing efficient chip-to-chip connections and heterogeneous integration through 2.5D and 3D packaging architectures. The demonstration's compliance with the latest UCIe 3.0 specifications points to InPsytech's leadership in cutting-edge process technologies and the flourishing chiplet ecosystem.

David Hsu, Chief Operating Officer at InPsytech, stressed the company's commitment to fostering innovation within the semiconductor industry. “We are proud to demonstrate our leadership alongside Alcor Micro at the OCP Global Summit. We fully believe in the future of UCIe within the Arm Chiplet ecosystem and are confident that our UCIe technology will accelerate the adoption of chiplets, leading to more innovation and advancements globally,” Hsu remarked.

Moreover, InPsytech's UCIe technology is successfully adopted in Mobius100 (CSS V3), Alcor Micro’s latest CPU platform based on the Arm architecture. This platform supports matrix-to-matrix CPU interconnections and flexible integration with GPUs, NPUs, and various AI accelerators, fostering advancements in heterogeneous computing and chiplet design. Both InPsytech and Alcor Micro are part of the Arm Total Design (ATD) program, encouraging collaboration and innovation in the Arm Chiplet ecosystem.

The OCP Global Summit 2025 will serve as a platform for offering insights into how the latest technological advancements can enhance data processing and increase efficiencies within semiconductor designs. With an emphasis on UCIe 3.0’s capabilities, InPsytech aims to showcase its role in transforming the landscape of chiplet integration and semiconductor technology.

In conclusion, the exhibition at the OCP Global Summit 2025 is critical not only for InPsytech and its partnership with Alcor Micro but also for stakeholders interested in the future of semiconductor design and the continued evolution of chiplets in technology. The advancements presented through UCIe 3.0 promise to pave the way for unprecedented innovations in high-speed data transfer and energy-efficient designs, setting new benchmarks for the industry at large.