E&R Engineering Unveils Innovative Laser and Plasma Technologies at SEMICON SEA 2025 Event
E&R Engineering Corp. is excited to announce its participation in the SEMICON Southeast Asia 2025, taking place at the Sands Expo & Convention Centre in Singapore from May 20 to 22, 2025. As an established leader in the semiconductor industry with over 30 years of experience, E&R is set to unveil its latest advancements in laser and plasma processing technology, enhancing the future of semiconductor equipment.
This year, E&R Engineering has formed a formidable partnership with two key collaborators—Zen Voce and GP Group. Together, the trio combines a wealth of expertise across various sectors of the semiconductor industry, from front-end solutions and packaging to back-end processing and automation. This collaboration embodies the philosophy that the combined strengths of the three partners can yield greater success than each could alone, summarized in the mantra "1 + 1 + 1 > 3".
E&R Engineering will showcase several innovative solutions at the event:
1. Plasma Dicing Technology
E&R’s plasma dicing solution couples advanced laser grooving with plasma technology to support ultra-fine dicing lanes ranging from 10–30 μm. In addition to the equipment, E&R offers a full turnkey dicing service capable of handling unique shapes such as hexagons, circles, or MPR layouts with consistency and high precision.
2. Fan-Out Panel Level Packaging (FOPLP)
The E&R solution for large panel processes includes comprehensive services like laser marking, cutting, descumming, plasma cleaning, and post-drill de-smear processes, maintaining impressive warpage control of up to 16 mm. Further enhancements include laser debonding and plasma dry etching techniques aimed at effectively separating glass carriers from panels.
3. Glass Substrate Solutions
As a leader in the glass core process equipment landscape, E&R provides:
- High-productivity TGV drilling with a performance rate of 600–1,000 VPS and a precision tolerance of ±5 μm at a 3σ level.
- Laser polishing capabilities focused on controlling sidewall roughness.
- Laser beveling for accurate Automatic Optical Inspection (AOI) targeted at defect detection.
4. Advanced Packaging Techniques
- Precision laser drilling technology developed for 2.5D and 3D ICs, maintaining a tolerance of ±5 μm and a backside-to-top ratio of up to 90%.
- A hybrid approach combining laser and plasma technologies for advanced Through-Silicon Via (TSV) solutions.
- Multi-beam laser marking with ±25 μm accuracy ensuring high throughput.
- Controlled thermal laser cutting processes providing additional reliability.
E&R Engineering, along with its partners Zen Voce and GP Group, will be showcasing these groundbreaking technologies and more at SEMICON SEA 2025. Attendees can learn about the future of semiconductor manufacturing where precision, efficiency, and integration meet.
Booth Information
For additional information, visit E&R Engineering’s official website.
This year, E&R Engineering has formed a formidable partnership with two key collaborators—Zen Voce and GP Group. Together, the trio combines a wealth of expertise across various sectors of the semiconductor industry, from front-end solutions and packaging to back-end processing and automation. This collaboration embodies the philosophy that the combined strengths of the three partners can yield greater success than each could alone, summarized in the mantra "1 + 1 + 1 > 3".
Featured Technologies from E&R
E&R Engineering will showcase several innovative solutions at the event:
1. Plasma Dicing Technology
E&R’s plasma dicing solution couples advanced laser grooving with plasma technology to support ultra-fine dicing lanes ranging from 10–30 μm. In addition to the equipment, E&R offers a full turnkey dicing service capable of handling unique shapes such as hexagons, circles, or MPR layouts with consistency and high precision.
2. Fan-Out Panel Level Packaging (FOPLP)
The E&R solution for large panel processes includes comprehensive services like laser marking, cutting, descumming, plasma cleaning, and post-drill de-smear processes, maintaining impressive warpage control of up to 16 mm. Further enhancements include laser debonding and plasma dry etching techniques aimed at effectively separating glass carriers from panels.
3. Glass Substrate Solutions
As a leader in the glass core process equipment landscape, E&R provides:
- High-productivity TGV drilling with a performance rate of 600–1,000 VPS and a precision tolerance of ±5 μm at a 3σ level.
- Laser polishing capabilities focused on controlling sidewall roughness.
- Laser beveling for accurate Automatic Optical Inspection (AOI) targeted at defect detection.
4. Advanced Packaging Techniques
- Precision laser drilling technology developed for 2.5D and 3D ICs, maintaining a tolerance of ±5 μm and a backside-to-top ratio of up to 90%.
- A hybrid approach combining laser and plasma technologies for advanced Through-Silicon Via (TSV) solutions.
- Multi-beam laser marking with ±25 μm accuracy ensuring high throughput.
- Controlled thermal laser cutting processes providing additional reliability.
Join E&R at SEMICON SEA 2025
E&R Engineering, along with its partners Zen Voce and GP Group, will be showcasing these groundbreaking technologies and more at SEMICON SEA 2025. Attendees can learn about the future of semiconductor manufacturing where precision, efficiency, and integration meet.
Booth Information
- - Booth Number: #L2413
- - Location: Sands Expo & Convention Centre, Singapore
- - Event Dates: May 20–22, 2025
For additional information, visit E&R Engineering’s official website.
Topics Consumer Technology）
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