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E&R Unveils Laser and Plasma Technologies for Advanced Packaging at SEMICON Taiwan 2025

E&R Unveils Laser and Plasma Technologies for Advanced Packaging

E&R Engineering Corp. is set to showcase groundbreaking laser and plasma technologies at the upcoming SEMICON Taiwan 2025. As artificial intelligence (AI), high-performance computing (HPC), and 5G drive innovations in the semiconductor sector, advanced packaging is emerging as the next focal point of development in this rapidly evolving field.

According to estimates by the Yole Group, the advanced packaging market is projected to exceed $50 billion by 2025, with the market for Fan-out Panel Level Packaging (FOPLP) expected to grow annually by over 15%. With this tremendous growth on the horizon, E&R aims to position itself at the forefront of technological innovation.

Highlighted Technologies at SEMICON Taiwan 2025

E&R will offer an extensive range of laser and plasma solutions tailored for FOPLP, Through-Silicon Via (TSV), Through-Glass Via (TGV), and plasma dicing. These fully integrated process technologies are designed to assist clients in tackling challenges related to high input/output density, warpage control, and ultra-fine features, essential for modern semiconductor manufacturing.

FOPLP Solutions

The company provides a complete equipment portfolio, which includes laser marking, dicing, plasma cleaning, laser debonding, and ABF drilling capabilities for plates up to 700×700 mm. The advanced systems ensure productivity while processing substrates with warpage of up to 16 mm, creating a balance between precision and efficiency.

TSV Applications

TSV technology plays a crucial role in high-density integration, particularly with the rising popularity of 3D packaging and advanced memory solutions. E&R's offerings in drilling, cleaning, and debonding, combining laser and plasma technologies, guarantee precise via profiles while minimizing defects and ensuring reliable connections across various wafer sizes and materials.

Innovations in Glass Substrates

In the burgeoning glass substrate segment, E&R’s laser modification processes achieve exceptional via roundness exceeding 0.9, with an aspect ratio of 101 and drilling capabilities reaching 1,500 vias per second. The solutions support CoPoS and ABF substrate applications, fostering robust and yield-efficient manufacturing practices. Alongside E-Core partners, E&R will also introduce a comprehensive metallization-capable process flow for glass substrates, further enhancing their technology stack.

Complete Packaging and Process Support

Developed and manufactured in Taiwan, E&R’s equipment, equipped with components from leading U.S. and European manufacturers, has been deployed over 500 times globally. These solutions have been widely adopted by major OSATs (Outsourced Semiconductor Assembly and Test) and IDMs (Integrated Device Manufacturers) in fields like FCBGA, FCCSP, fan-out, and wafer-level packaging. The company has also expanded its Flip Chip BGA portfolio, introducing pre-flip chip die bond plasma cleaning, pre-molding/underfill plasma cleaning, and laser marking for traceability purposes.

In 2025, E&R introduced a fully automated high-power burn-in solution capable of supporting test environments with power levels that reach up to 3,000 W. The innovative solutions offered by E&R are designed to push the boundaries of what's possible in semiconductor manufacturing.

Invitation to Explore

E&R invites industry partners to visit their booth at SEMICON Taiwan 2025, where they can engage with the technical team and investigate the next generation of packaging and dicing technologies. Don't miss this opportunity to witness how E&R is paving the way for the future of advanced packaging.

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